Shin-etsu Chemical Co., Ltd.

Other

Nissan Motor Company Limited

Shin-etsu Chemical C O., Ltd.

Mikio Shiono

Kenichi Fukuda

Hironao Fujiki

Takashi Matsuda

Hidenori Koshikawa

Osamu Watanabe

Koichi Ito

Hiroyasu Hara

Teruo Fujimoto

Noriyuki Koike

Hiromasa Yamaguchi

Toshiaki Takahashi

Mitsuo Muto

Kazumi Okada

Masatoshi Arai

Hirofumi Kishita

Masayuki Ikeno

Toshiyuki Ozai

Takeshi Hashimoto

Takashi Aketa

Yujiro Taira

Kazunori Kawasaki

Shinichi Ide

Mitsuaki Igarashi

Yoshifumi Inatani

Tadashi Harada

A curable perfluoropolyether based gel composition is provided comprising (A) a linear fluorinated polymer containing at least two alkenyl groups, (B) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone, (C) a cyclic organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and at least one perfluoroalkyl group or perfluoropolyether structure-containing group, and (D) a hydrosilylation reaction catalyst. The composition cures into a gel having improved acid resistance as well as heat resistance, solvent resistance, chemical resistance, weatherability, parting property, and water/oil repellency.

Curable perfluoropolyether based gel composition and gel product using cured composition

The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3. The present invention provides a curable composition for encapsulating an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and an optical semiconductor apparatus in which an optical semiconductor device is encapsulated by a cured product obtained by curing the curable composition for encapsulating an optical semiconductor.

Curable composition for encapsulating optical semiconductor and optical semiconductor apparatus using the same

An adhesive composition is provided comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a hydrosilylation catalyst, (D) hydrophobic silica powder, (E) a fluorinated acetylene alcohol, and (F) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. A cured product of the composition has a smooth and uniform surface.

Adhesive composition

A method of producing a base compound for a liquid fluoroelastomer which is unaffected by the storage state of the added silica powder, and yields minimal fluctuation in the viscosity between production lots. Specifically, a method of producing a base compound for a liquid fluoroelastomer containing:

Method of producing base compound for liquid fluoroelastomer

There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.

Optical semiconductor sealing curable composition and optical semiconductor apparatus using this

A curable perfluoropolyether gel composition is provided. The composition comprises (A) a straight chain fluorine-containing polymer represented by the following formula (1): (B) a polyfluoromonoalkenyl compound containing one alkenyl group per molecule and having a perfluoropolyether structure in its backbone, (C) an organosilicon compound containing at least two hydrogen atoms bonded to the silicon atom per molecule, and (D) a hydrosilylation catalyst. The composition can be produced into a cured product having excellent heat resistance, solvent resistance, chemical resistance, weatherability, releasability, water repellency, oil repellency, and the like as well as an improved acid resistance.

Curable perfluoropolyether gel composition and gel product produced by using cured perfluoropolyether gel composition

A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100&#xb0; C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150&#xb0; C. A method for adhering the composition to the substrate is also provided. The composition comprises (A) a straight chain polyfluoro compound, (B) a fluorine-containing organohydrogenpolysiloxane containing at least 2 SiH groups and not containing other functional group, (C) a platinum group metal catalyst, (D) a fluorine-containing organohydrogenpolysiloxane containing a fluorine-containing organic group, SiH group, epoxy group and/or tri(organoxy)silyl group, and an aryl group, (E) a polyhydric allyl ester compound, (F) an organosilicon compound having epoxy group and an organoxy group, and not containing SiH group, and (G) an organosilicon compound having SiH group and an aryl group, and not containing epoxy group or a tri(organoxy)silyl group, or a fluorine-containing organic group.

Thermosetting fluoropolyether adhesive composition and adhesion method

A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.

Addition-cure fluoropolyether adhesive composition

A fluoropolyether base rubber composition comprising (a) a linear fluoropolyether compound containing at least two ester groups in a molecule and a divalent perfluoroalkyl ether structure in its backbone, and having a Mn of 3,000-100,000, and (b) a siloxane polymer containing at least three amino groups in a molecule cures at room temperature into a product having heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance.

RT curable fluoropolyether base rubber composition and cured product

An adhesive composition is provided comprising (A) a fluorinated amide compound containing at least two vinyl groups and having a polyfluoro structure, (B) a fluorinated organosilicon compound containing a fluorinated organic group, at least two SiH groups, and an alkyl, aryl or aralkyl group, and (C) a platinum catalyst, and (D) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. The composition is cured on brief heating into a product which achieves adhesion to various substrates and has solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability, electric insulation, and acid resistance.

Perfluoropolyether compositions are provided comprising: (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units &#x2014;CFO&#x2014; in its backbone, and having a molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.

Curable perfluoropolyether compositions and rubber or gel articles comprising the same

A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20&#xb0; C. to less than 100&#xb0; C.

Heat-curable fluoropolyether adhesive composition and bonding method

A rubber article is manufactured by heat curing a heat-curable silicone rubber composition filled with untreated fumed silica to form a substrate, applying a primer composition comprising a fluoroalkylene or fluoropolyether compound having at least one alkenyl radical and at least one hydrolyzable silyl radical onto the substrate surface, and disposing a heat-curable perfluoropolyether elastomer composition thereon and curing the composition for integration. The integrally molded article has characteristics of both silicone rubber and fluoroelastomer.

Method for preparing silicone rubber/fluoroelastomer integrated rubber article

A coating composition comprises a fluoroelastomer composition and a diluent solvent consisting of a perfluoroalkyl-substituted aromatic compound and a perfluoro organic compound, the fluoroelastomer composition comprising (A) a linear perfluoropolyether compound, (B) a fluorinated organohydrogensiloxane, (C) a platinum catalyst, and (D) an organopolysiloxane containing an SiH group and an epoxy or trialkoxysilyl group. The composition cures into a fluoroelastomer having excellent characteristics and achieves a firm adhesion to a broad range of substrates by brief heating at relatively low temperatures.

Coating composition

An adhesive composition comprising the following components:

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Annaka, Japan

Mikio Shiono