Nec Corporation

Japan Aviation Electronics Industry, Limited

Nec Toppan Circuit Solutions, Inc.

Nec Electronics Corporation

Tokyo Institute of Technology

Nec C Orporation

Mikio Oda

Hikaru Kouta

Hisaya Takahashi

Sakae Kitajo

Hideyuki Ono

Yuichi Koreeda

Yuzo Shimada

Hideo Kikuchi

Naoki Katagiyama

Koji Soejima

Junichi Sasaki

Takashi Ohtsuka

Masahiko Fujiwara

Yoshinobu Kaneyama

Nobuaki Takahashi

Yasuhiro Sasaki

Kaichiro Nakano

Jun Sakai

Kazuhiko Kurata

Yuji Akimoto

Nobuharu Kami

Yutaka Urino

Ichiro Hatakeyama

Taro Kaneko

Mitsuru Yamamoto

Kazunori Miyoshi

Masataka Itoh

Kohroh Kobayashi

Mitsuru Kurihara

Hiroyuki Honma

Tadahiko Hanada

Masataka Ito

Arihide Noda

Tomotaka Ishida

Yoshio Matsumoto

Kaichirou Nakano

Wataru Ohtsu

Tomohiko Aso

Kazuhito Asada

Shinichi Tamabayashi

Seiji Suda

An optical connector has a pair of coil springs () which are disposed so as to sandwich an optical fiber () led out of the rear of a ferrule () in substantially the axial direction (A) and which extend in the axial direction (A).

Optical connector capable of assembling therein optical fiber led out from rear of ferrule and optical connector system containing same

Optical connectors can be easily attached to and detached from a housing. An optical connector deviceadapted to be connected to a mating optical connector deviceincludes a first housingfor receiving and holding optical connectors, a second housingfor holding the first housingin a floating manner, and a fixing memberfor fixedly attaching the second housingto an attachment object. To-be-locked portionsof the first housingand locking portionsof the second housingdetachably engage with each other and cause the first housingto engage with the second housingin a floating manner. The to-be-locked portionsand the locking portionsengage with each other in a direction perpendicular to a direction Aof connection to the mating optical connector device

Optical connector device and mating optical connector device

The light source is disposed in a direction traversing the axial direction A of the optical connector. The optical connector holder comprises an inspection light reflecting portion. The inspection light reflecting portion deflects and reflects the inspection light from the light source to the axial direction A so that the inspection light enters the reference hole portion of the optical connector.

Combination of optical connector inspection apparatus and optical connector capable of inspecting a held posture of an optical fiber

In a photoelectric conversion/connection device () including an optical element (), a mounting board () on which the optical element is mounted, and an optical connector () which is connected to the mounting board so as to be optically connected to the optical element, the optical connector () is arranged on a surface () opposite to a mounting surface () of the mounting board () and the optical element () is exposed. The photoelectric conversion/connection device () includes a motherboard () having a main surface () and an electric connector () to be mounted on the main surface of the motherboard. The electric connector () is detachably connected to the mounting board ().

Photoelectric conversion/connection device

Optical elements (light sourcesor photodetectors) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguidesis defined such that optical waveguidesextend between the optical elements in the two-dimensional array substantially parallel to substratefor increased parallelism. Micromirrorsare disposed in respective optical waveguidesto bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrorsacross the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides, which is small in size and high in efficiency, and is of high parallelism.

Connection structure of two-dimensional array optical element and optical circuit

Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.

Optical interconnection device

In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.

Assembly-type durable optical connector adapter

In an optical connector including a base housing, a cover housing, and a clamp fixing the cover housing to the base housing, the base housing is provided with a groove for positioning and holding an optical fiber of an optical cable, a first recessed portion continuously formed from the groove, and a second recessed portion continuously formed from the first recessed portion. The first and the second recessed portions have bottom portions different in level from each other to have a stepped portion formed therebetween. The cover housing has a first coating portion for covering the groove and a second coating portion for covering the first and the second recessed portions. The bottom portion of the second recessed portion and the second coating portion presses a coating member of the optical cable to clamp the optical cable.

Optical connector having an internal clearance at a part to be connected to an optical fiber

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

In a method for fabricating an optical circuit, a mirror element with a protection film formed within a die of a semiconductor is connected to a substrate at a predetermined position. The mirror element with the protection film connected to the substrate is peeled from the die of the semiconductor. The protection film is removed to expose a reflection surface of a reflection film of the mirror element.

Optical circuit in which fabrication is easy

Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening is formed at the position of the pit. Then, an electric field is applied to the high-concentration impurity Si template and Au is buried in the opening in the plated resist to form a Au-plated buried layer. An electrode pad is formed on a semiconductor chip. With the plated resist separated from the high-concentration impurity Si template, the electrode pad of the semiconductor chip is aligned with the Au-plated buried layer and is bonded by thermo-compression bonding. The Au-plated buried layer is transferred to the electrode pad to form an Au bump on the semiconductor chip.

Method for forming contact bumps for circuit board

There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk

The present invention relates to a device and a method for monitoring each of the propagated light beams that are propagated in each waveguide of an arrayed waveguide device and a method of fabricating the device. In the prior art, problems were encountered in deriving monitor light and photodetecting the derived monitor light within the waveguide substrate. In the present invention, waveguide directional couplers are formed in the spaces between the arrayed waveguides to derive a portion of the propagated light as monitor light. Cavities are provided at the ends of auxiliary waveguides connected to the directional couplers, and monitor light is guideded into these cavities. The monitor light, after being reflected upward or downward of the substrate by optical path conversion elements installed inside the cavities, is photodetected by photodiodes. The optical path conversion elements can be fabricated by inserting metal bumps into the cavities and then forming the bumps with a mold.

Optical circuit element and production method therefor, array-form optical circuit element, optical circuit device using it

After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board

An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Optical waveguide board and optical module

Growing community of inventors

Tokyo, Japan

Mikio Oda