Nissan Motor Company Limited

Dow Corning Toray Company, Ltd.

Fuji Polymer Industries Co., Ltd.

Mikio Naruse

Kazuyoshi Abe

Atsushi Ehira

Motoyuki Furukawa

Kazuhiro Ogawa

Akihiro Shibuya

Hirotoshi Oota

Atsushi Ikezawa

Takaya Ishii

Toru Kakehi

An electronic component casing includes: an inclined portion that projects from an upper surface so as to increase in height gradually from one side; a step portion that descends as a continuation of an upper end of the inclined portion or descends via a plane connected to the upper end; and a planar portion connected to a lower end of the step portion.

Electronic component casing

A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.

Heat dissipation assembly and method for producing the same

An insulation sheet is formed by a heat conductive filler of an amount of 70&#x2013;93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.

Insulation sheet and apparatus utilizing the same

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Isehara, Japan

Mikio Naruse