Fuji Machine Mfg. Co., Ltd.

Fuji Corporation

Edeclinseysystem Co., Ltd.

Mikio Nakajima

Kazumi Hoshikawa

Masafumi Amano

Yusuke Yamakage

Mitsutaka Inagaki

Kenji Sugiyama

Hiroyuki Ao

A mounting inspection device includes a missing component inspection device and a foreign object inspection device. The missing component inspection device is for performing missing component inspection of components mounted on a printed circuit board. The foreign object inspection device is for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to the printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.

Mounting inspection device

A number one camera and number two camera are provided in the top section and lower section of a mounting and inspection data creation device. A number one lighting device and top side shielding plate are provided on the lower side of a lens of number one camera. A number two lighting device and lower side shielding plate are provided on the top side of a lens of number two camera. Component is set on transparent setting plate that is positioned between top side shielding plate and lower side shielding plate, and when imaging the top side (pickup side) of component with number one camera, top side shielding plate is slid out of the imaging area of number one camera. When imaging the bottom side (mounting side) of component with number two camera, lower side shielding plate is slid out of the imaging area of number two camera. Mounting data is created based on component bottom side image taken by number two camera, and inspection data is created based on component top side image taken by number one camera.

Mounting and inspection data creation device and mounting and inspection data creation method

A circuit-substrate-related-operation performing apparatus for performing a circuit-substrate-related operation which is an operation on a circuit substrate, including: a plurality of heads including at least one work head and at least one detection head; a head holding device configured to hold, at a holding portion thereof, one of the plurality of heads; a moving device configured to move the head holding device; a head stock device in which the plurality of heads are stocked; and a controller configured to control the circuit-substrate-related-operation performing apparatus, wherein the controller includes a head attachment control portion configured to control the moving device and the head holding device such that the head holding device is moved to a set position which is set with respect to the head stock device and such that an arbitrary one of the plurality of heads is held by the head holding device.

Circuit-substrate-related-operation performing apparatus

An existing electronic part mounting device can have the function of correcting the parallax of a camera pickup image only by addition or modification of software without using a telecentric lens. For this, storage means stores in advance parallax data representing the relationship between the height of an electronic part to be picked up by a camera and a part size per pixel for each pixel of the pickup image or image magnification. When picking up the electronic part adsorbed by an adsorption nozzle () by the camera, the part height data on the height of the electronic part is acquired, so that according to the part height data and the aforementioned parallax data, a part size per pixel or image magnification is corrected for each pixel of the pickup image of the electronic part, thereby correcting the parallax of the pickup image of the electronic part.

Growing community of inventors

Toyokawa, Japan

Mikio Nakajima