Panasonic Electric Works Co., Ltd.

Panasonic Corporation

Matsushita Electric Works, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Mikio Masui

Youji Urano

Kenichiro Tanaka

Masao Kubo

Shinji Matsui

Hiroshi Fukshima

Akira Inoue

Jun Tatsuta

Shinobu Kida

Hiroyuki Yoshida

The lighting device () includes an LED chip (), a mounting substrate () mounting thereto the LED chip, an encapsulation member () made of an encapsulating resin material for encapsulation of the LED chip, and a lens () made of a transparent resin material. The lens () is provided in its bottom with a recess () and is secured to the mounting substrate () with the encapsulation member () disposed within the recess (). The encapsulation member () is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

Light emitting device

Light emitting deviceincludes an LED chip, a mounting substratecarrying the LED chip, a dome-shaped color conversion member, and encapsulation member. Color conversion memberis molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip. Encapsulation memberis made of an encapsulation resin material to encapsulate LED chipand bonding wireswithin a space confined between mounting boardand color conversion member. Encapsulation memberis of a convex-shape to have its light output surfacekept in an intimate contact with an internal surface of color conversion member. Since the intimate contact between the convex-lens shaped encapsulation memberand the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.

A production method for producing a light-emitting devicein which a light-emitting layer at least comprised of a n-type substrate bearing layerand a p-type substrate bearing layeris layered on a transparent crystal substrateis provided with a step of forming a transfer layeron at least a part of the transparent crystal substrateor the light-emitting layer, which transfer layeris softened or set upon supplying an energy thereto; a step of pressing a moldformed with a minute unevenness structureagainst the transfer layerto transfer the minute unevenness structureto an outer surface of the transfer layer, and a step of forming a minute unevenness structurefor preventing multiple reflection based on the minute unevenness structuretransferred to the transfer layer

Method for producing a light emitting device

In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surfaceof nearly a parabola configuration or the like provided for light emission and reception by a photoelectric deviceis formed on a slanting curved surface constituting a concave partof a circuit substrateA convex portionprojecting from the light reflecting surfaceand a receding concave portionare formed in the middle of the concave partA stageis formed by an upper and bottom surfaces of the convex and concave portionsandrespectively. A bonding padfor connecting circuits of the photoelectric deviceis formed at the stageSince a space for the bonding padis provided by both concave and convex portions, deformation of the light reflecting surfacecaused by the receding concave portionand a ratio of intrusion to the bottom surface of the concave part by the projecting convex portioncan be both minimized. As a result, the photoelectric devicecan be mounted without largely lowering light emission efficiency or without decentering the light emitting and receiving center, whereby a photoelectric device-partcan be miniaturized.

Photoelectric device

Growing community of inventors

Kashihara, Japan

Mikio Masui