Fujikura Limited

Mikio Hashimoto

Satoshi Yamamoto

Takanao Suzuki

A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging.

Pressure sensor module

A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness Dof the semiconductor substrate, a thickness Dof the diaphragm section, a thickness Dof the cavity, and a thickness DD(DD) satisfy the relationships: (DD) in a range of approximately 5-20 &#x3bc;m, and Dnot less than about 100 &#x3bc;m.

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Sakura, Japan

Mikio Hashimoto