Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Mikio Aoki

Taiji Ito

Masaya Shimamura

Jin Mikata

Takehiko Kai

Kenzo Kitazaki

Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.

Wireless module and method for manufacturing the same

An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

Electronic component module and method of manufacturing the same

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.

Wireless module and method for manufacturing wireless module

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.

Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

Method of manufacturing electronic component module

A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.

Method of making plural electronic component modules

In a transmission section ( ), a light-emitting element ( ) is driven by a digital signal (DS ) serving as an object of transmission, light emitted from the light-emitting element ( ) is split by a beam splitter ( ) into two linearly polarized light components which are orthogonal to each other, and the linearly polarized light components are radiated by &frac14;-wavelength plates ( A and C) into the air as circularly polarized light components having the same rotating direction. In a reception section ( ), the circularly polarized light components radiated from the transmission section ( ) and circularly polarized light components having a reverse rotating direction are received by two different light-receiving elements ( A and B), and the difference of the levels of two electric signals output from the two light-receiving elements ( A and B) is calculated by a subtraction circuit ( ), so that a digital signal serving as an object of transmission is obtained by removing a disturbance noise component. With this arrangement, an optical digital communication apparatus which can reduce influence of disturbance optical noise, improve an S/N ratio, and extend a communication distance.

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Tokyo, Japan

Mikio Aoki