Mitsui Minings & Melting Co., Ltd.

Mikimasa Horiuchi

Yoichi Kamikoriyama

Hiroki Sawamoto

Yasuhide Yamaguchi

Kei Anai

Katsuhiko Yoshimaru

Akinori Kumagai

Takashi Mukuno

Sumikazu Ogata

Masayuki Matsuyama

Ken Matsuo

Ryutaro Kuroda

A polishing liquid is provided containing manganese oxide abrasive grains, permanganate ions, and a cellulosic surfactant or a cationic surfactant. The polishing liquid has a pH of 5 or more and 11 or less. The cellulosic surfactant is preferably a carboxymethyl cellulose or a derivative thereof. The cationic surfactant preferably has a quaternary ammonium ion site. The content of the cellulosic surfactant or the cationic surfactant is preferably 0.01 mass % or more and 1.0 mass % or less based on the total amount of the polishing liquid.

Polishing liquid and polishing method

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size Dof the longitudinal axis of the observed particles is 1.0 &#x3bc;m or less, and if the particle size Dof the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 &#x3bc;m or less.

Abrasive material

A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300&#xb0; C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness Rof 200 nm or smaller.

Nickel ink and conductor film formed of nickel ink

It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Conductive ink

Disclosed is a nickel ink comprising a dispersion medium and nickel particles dispersed in the medium and containing a methyldimethoxysilane coupling agent. The dispersion medium comprises a glycol having a boiling point of 300&#xb0; C. or lower at ambient temperature, an alkoxyethanol having 3 to 10 carbon atoms, and an ether having 2 to 8 carbon atoms. The ink preferably has a surface tension adjusted to 15 to 50 mN/m and a viscosity at 25&#xb0; C. adjusted to 0.6 to 60 mPa&#xb7;sec. The ink is preferably used in inkjet printing.

Growing community of inventors

Ageo, Japan

Mikimasa Horiuchi