Hoya Corporation

Avanstrate Inc.

Mikiko Morishita

Akihiro Koyama

Kazuaki Hashimoto

Satoshi Ami

Tetsuo Takano

The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO, 5% to 20% by mass of AlO, 6% to 30% by mass of NaO, and 0% to less than 8% by mass of LiO. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 &#x3bc;m/minute in an etching environment having a temperature of 22&#xb0; C. and containing hydrogen fluoride with a concentration of 10% by mass.

Growing community of inventors

Pyeongtaek-si, South Korea

Mikiko Morishita