Kabushiki Kaisha Toshiba

Kanto Kagaku Kabushiki Kaisha

Mikie Miyasato

Hiroshi Kawamoto

Yoshihiro Uozumi

Tsuyoshi Matsumura

Takahito Nakajima

Norio Ishikawa

Takuo Oowada

A photoresist residue remover composition is provided that removes a photoresist residue formed by a resist ashing treatment after dry etching in a step of forming, on a substrate surface, wiring of any metal of aluminum, copper, tungsten, and an alloy having any of these metals as a main component, the composition including one or two or more types of inorganic acid and one or two or more types of inorganic fluorine compound. There is also provided a process for producing a semiconductor circuit element wherein, in a step of forming wiring of any metal of aluminum, copper, tungsten, and an alloy having any of these metals as a main component, the photoresist residue remover composition is used for removing a photoresist residue formed by a resist ashing treatment after dry etching.

Photoresist residue remover composition and semiconductor circuit element production process employing the same

An insulating tube includes a underlying insulating film, a first sidewall insulating film disposed on the underlying insulating film, a second sidewall insulating film disposed on the underlying insulating film, opposite to the first sidewall insulating film so as to provide a cavity between the first and second sidewall insulating films having the same height as the first sidewall insulating film, and an upper insulating film provided over the first and second sidewall insulating films.

Insulating tube, semiconductor device employing the tube, and method of manufacturing the same

Insulating tube

Growing community of inventors

Yokohama, Japan

Mikie Miyasato