Toshiba Memory Corporation

Kioxia Corporation

Miki Toshima

Osamu Yamane

Satoshi Usui

Nobuhiro Komine

Manabu Takakuwa

Yosuke Okamoto

Sadatoshi Murakami

Takaki Hashimoto

An alignment apparatus according to one embodiment, includes: a first and a second stage; a first and a second detector; a first and a second moving mechanism; and a controller. The first and second stages are configured to respectively hold a first and a second semiconductor substrate on which a first and a second alignment mark are respectively disposed. The first and second moving mechanisms are configured to respectively move the first and second stages relatively to each other. The controller is configured to perform the following (a), (b). (a) The controller control the detectors and the moving mechanisms to cause the first detector to detect the second alignment mark and to cause the second detector to detect the first alignment mark. (b) The controller calculate a position deviation between the substrates in accordance with results of the detections.

Alignment apparatus and method of manufacturing semiconductor device

According to one embodiment, a quality control method of a position measurement light source includes irradiating light of the position measurement light source on a plurality of marks having different heights and measuring a relationship between the height of the mark and an intensity of light reflected by the mark. The quality control method includes identifying a wavelength of the position measurement light source by comparing measurement data acquired by the measuring to reference data of a relationship between the height of the mark and an intensity of reflected light for each of a plurality of wavelengths.

Quality control method of position measurement light source, semiconductor manufacturing apparatus, and method for manufacturing semiconductor device

According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of &#x3bb;1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of &#x3bb;1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of &#x3bb;2 shorter than the wavelength of &#x3bb;1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.

Position measuring method, position measuring apparatus, and semiconductor device manufacturing method

According to one embodiment, a value of a film thickness of a processing object disposed above a substrate is obtained. Then, a wavelength that provides a highest degree of intensity of signal light reflected when the signal light is incident onto the processing object having the value of the film thickness, based on wavelength selection reference information is selected. Then, a first instruction performing an alignment process to the substrate by use of signal light having a wavelength thus selected is generated. The wavelength selection reference information is information that includes a correlation between values of the film thickness of the processing object and degrees of intensity of the signal light, with respect to a plurality of wavelengths.

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Yokohama, Japan

Miki Toshima