Jsw Aktina System Co., Ltd.

Miki Sawai

Yoshihiro Yamaguchi

Hirotaka Sazuka

Naoyuki Kobayashi

Sadao Tanigawa

A laser processing apparatus () according to an embodiment includes a processing chamber () configured to perform laser processing for an object to be processed (), a stage () disposed inside the processing chamber (), the stage being configured to convey the object to be processed (), and a control unit () configured to instruct a loading/unloading apparatus () about a placement position of the object to be processed () over the stage (), the loading/unloading apparatus () being configured to load/unload the object to be processed () into/from the processing chamber (). Further, the processing chamber () includes a loading gate () for loading and an unloading gate () for unloading for the object to be processed (), and the object to be processed () is conveyed only in a first direction from the loading gate () toward the unloading gate () over the stage ().

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Yokohama, Japan

Miki Sawai