Shinko Electric Industries Co., Ltd.

Nippon Tungsten Co., Ltd.

Japan Fine Ceramics Center

Trek Holding Co., Ltd.

Miki Saito

Koki Tamagawa

Tadayoshi Yoshikawa

Norio Shiraiwa

Mitsuyoshi Nagano

Toshio Uehara

Takahiko Suzuki

Hideaki Matsubara

Hiroshi Yonekura

Naoto Watanabe

Shuzo Aoki

Tetsushi Matsuda

Kouta Tsutsumi

A substrate fixing device includes a base plate including therein a gas supply section, and an electrostatic chuck provided on the base plate. The electrostatic chuck includes a base having a mounting surface on which a target to be held by electrostatic attraction is mounted, an insertion hole, penetrating the base, having an inner surface that defines the insertion hole and is threaded to form a female thread, and a screw member, having an outer surface that is threaded to form a male thread, and inserted into the insertion hole to assume a mated state in which the male thread mates with the female thread. A gas from the gas supply section is supplied to the mounting surface via the screw member.

Substrate fixing device

A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.

Tray and wafer holding apparatus

A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 10to 10(&#x3a9;&#xb7;cm) necessary for a Johnsen-Rahbek type electrostatic chuck.

Dielectric layer for electrostatic chuck and electrostatic chuck

A substrate temperature regulation fixed apparatus has a base substance on which a vacuumed object is placed, an adhesive layer and a base plate. The base substance is fixed on the base plate through the adhesive layer. The adhesive layer contains a substance having plasma resistance.

Substrate temperature regulation fixed apparatus

A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.

Substrate temperature control fixing apparatus

Growing community of inventors

Nagano, Japan

Miki Saito