Sekisui Chemical Co., Ltd.

Miki Inaoka

Takahiro Oomura

Hiroji Fukui

Hiroshi Yamauchi

Kenji Yamauchi

Shigeru Nomura

Naoyuki Nagatani

Takamaro Kakehi

It is an object of the present invention to provide a binder resin composition usable for an inorganic fine particle-dispersed paste composition which is excellent in thixotropy and storage stability, has scarcely changeable screen printability with the lapse of time, and can be fired at a low temperature, and to provide the inorganic fine particle-dispersed paste composition. The present invention is directed to a binder resin composition, which contains a binder comprising a (meth)acrylic resin, an organic compound having 3 or more hydroxyl groups, and an organic solvent, the content of the organic compound having 3 or more hydroxyl groups being 0.1 to 15 parts by weight to 100 parts by weight of the (meth)acrylic resin.

Binder resin composition and inorganic fine particle-dispersed paste composition

It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter. The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300&#xb0; C.

Thermally disappearing resin particle

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Osaka, Japan

Miki Inaoka