Rohm Co., Ltd.

Miki Hasegawa

Chojiro Kuriyama

Yasuo Kanetake

Shinji Nakamura

Tatsuhiko Oshima

A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.

Process for making a tantalum capacitor chip

A package-type solid electrolytic capacitor is provided which comprises a capacitor element, an insulating package body having a housing recess with an upward opening for receiving the capacitor element, and an insulating closure member for closing the opening of the housing recess. The capacitor element has an anode layer formed on one end and a cathode layer formed at least on the other end. The housing recess is formed with two internal electrodes in electrical conduction with the anode and cathode layers, respectively, of the capacitor element. The package body is externally formed with two terminal electrodes in electrical conduction with the respective internal electrodes.

Package-type solid electrolytic capacitor

A fuse arrangement includes a fuse element having a serpentine shape disposed resilient and incombustible or fire-resistant insulating plates and external connection terminals formed at the fuse arrangement. A capacitor has a safety fuse with a fuse element formed between two insulating plates affixed to one end surface of a chip piece of the capacitor so that one end of the safety fuse element is electrically connected to one electrode of the capacitor, and a connection terminal electrode film is formed on the outer surface of the safety fuse body connected to the other end of the safety fuse element.

Fuse arrangement and capacitor containing a fuse

A tantalum capacitor chip and lead terminals respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side and at a base side. The resin is provided with a structure in which its upper half is longer than its lower half at both sides. The base side portion of the portion not molded in the resin, of each of the lead terminals is curved downward with a predetermined radius of curvature, and an inwardly bent portion is formed on the tip side of the base side curved portion of the protruding portion.

Packaging device and its manufacturing method

A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.

Method of forming a ball end for a solder wire

Tantalum capacitor chip, process for making the same and tantalum

A solid electrolytic capacitor is provided which comprises a capacitor element including a porous sintered chip of metal particles, a solid electrolytic substance electrically insulated from the metal particles by a dielectric substance, an anode terminal layer electrically connected to the metal particles, and a cathode terminal layer electrically connected to the solid electrolytic substance. The capacitor element has a terminal portion located adjacent to the anode terminal layer and provided with barrier means for preventing the solid electrolytic substance from entering to the terminal portion.

Solid electrolytic capacitor and method of making the same

A resin-packaged electronic component is provided which comprises an electronic element enclosed in a thermosetting resin package having a mounting face. The resin package is provided with at least one stress concentrating portion extending substantially in parallel to the mounting face and contained in an imaginary plane extending between the electronic element and the mounting face.

Resin-packaged electronic component

An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.

Resin-packaged electronic component having bent lead terminals

An electronic part assembly composed of a wiring board formed with a wiring circuit, and a plurality of electronic parts mounted to the wiring board, in which the wiring board is composed of a plurality of stages stacked up; the electronic parts are sorted into large parts which are high profile and small parts and disposed separately on the wiring board, while at least some of the small parts are each vertically disposed in the longitudinal direction of the wiring board and connected to adjacent stages of the wiring board by means of leads extending from the bath sides thereof.

Electronic part assembly

The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.

Growing community of inventors

Kyoto, Japan

Miki Hasegawa