Jgc Catalysts & Chemicals Ltd.

Catalysts & Chemicals Industries Co., Ltd.

Fujitsu Corporation

Other

Miki Egami

Ryo Muraguchi

Michio Komatsu

Mitsuaki Kumazawa

Akira Nakashima

Toshiharu Hirai

Hirotada Arakane

Ei Yano

Katsumi Suzuki

Yoshihiro Nakata

Hiroki Arao

Masanobu Taniguchi

Tsuguo Koyanagi

Kazutaka Egami

Shogo Hayashi

Takuji Miyamoto

Ei c/o Fujitsu Limited Yano

Yoshihiro Fujitsu Limited Nakata

A silica particle dispersion liquid includes a silica particle that satisfies (i) to (iii) below: (i) an average particle diameter d is 5 to 300 nm; (ii) an occlusion amount of a basic substance per 1 g of the particle is 2 mg or more; and (iii) a Sears number Y exceeds 12.0.

Silica particle dispersion liquid and production method thereof

A porous silica particle has disintegration properties. The porous silica particle has an average particle diameter of 0.5 to 50 μm, a pore volume of 0.5 to 5.0 cm/g, a mode of a pore diameter of 2 to 50 nm, a shape factor of 0.8 to 1.0, an average compression strength of 0.1 to less than 1.0 kgf/mm, a sodium content of 10 ppm or less, and a network structure.

Porous silica particles and method for producing same

There is provided a production method of a chain silica particle dispersion. This production method includes a dispersion preparation step of hydrolyzing alkoxysilane in the presence of ammonia to prepare a silica particle dispersion, an ammonia removal step of removing the ammonia from the silica particle dispersion such that an ammonia amount relative to silica contained in the silica particle dispersion is 0.3% by mass or less, and a hydrothermal treatment step of hydrothermally treating the silica particle dispersion having a silica concentration of 12% by mass or more, from which the ammonia has been removed, at a temperature of not lower than 150&#xb0; C. and lower than 250&#xb0; C. An abrasive including such chain silica particles is high in polishing rate and excellent in polishing properties.

Method for producing chain-like particle dispersion, and dispersion of chain-like particles

Provided is a production method of a silica particle dispersion liquid which includes, preparing a linked silica particle by adding a liquid A containing alkoxysilane and a liquid B containing an alkali catalyst to a liquid containing water, an organic solvent, and an alkali catalyst in a container. The preparing a linked silica particle includes initially adding an alkali catalyst, the initially adding an alkali catalyst includes decreasing a molar ratio of an alkali catalyst to silica in the liquid in the container to 0.15 to 0.60 by adding the liquid A containing alkoxysilane to the liquid in the container, and increasing the molar ratio by 0.2 or more by adding the liquid B to the liquid having the decreased molar ratio in the container.

A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.

Dispersion liquid of silica particles, polishing composition, and method for producing dispersion liquid of silica particles

Provided is a dispersion liquid of silica particles, comprising silica particles having an average particle diameter of 5 to 300 nm determined from an electron micrograph and a density of 1.20 g/cmor more determined from a specific surface area determined by a BET method using nitrogen adsorption, wherein the dispersion liquid has a pH of less than 8, a silica concentration of 12 to 40% by mass, and a viscosity in terms of a silica concentration of 20% by mass of 40 mPa&#xb7;s or less. When this silica particle is used as an abrasive, it is possible to realize a sufficient polishing speed and a smooth polished surface on which occurrence of scratches is suppressed.

Dispersion liquid of silica particles and production method therefor

A method for producing a dispersion liquid of silica particles, by simultaneously adding a liquid A containing silane alkoxide and a liquid B containing an alkali catalyst and water to a liquid I containing silica seed particles to cause the particles to grow, so as to produce silica particles; wherein the variation rate of the mole ratio of the alkali catalyst to silica components in the reaction system during a period from the start to the end of the addition relative to the initial mole ratio is 0.90 to 1.10; and the variation rate of the mole ratio of water to the silica components in the reaction system during a period from the start to the end of the addition relative to the initial mole ratio is 0.90 to 1.10.

Production method for dispersion liquid of silica particle

A method for producing a liquid dispersion containing irregular-shaped silica particles in which two or more primary particles are linked together, by simultaneously adding a liquid A containing silane alkoxide and a liquid B containing an alkali catalyst and water to a liquid I consisting substantially of an organic solvent to cause hydrolysis and polycondensation of the silane alkoxide, wherein the period from the start of the addition until the silica concentration of the reaction system at the end of the addition reaches 70% is 20% or less of the full reaction time period.

Silica particle liquid dispersion and production method therefor

Silica particles calcined in a calcination step are supplied in a swirling flow generated by a gas introduced in a disintegration container and disintegrated therein, whereby the silica particles can be easily disintegrated and there can be obtained disintegrated silica particles having both low hygroscopicity and high dispersibility in resin. In addition, the introduction of dehumidified air (gas) during the disintegration reduces hygroscopicity and greatly improves dispersibility in resin. Furthermore, performing heating treatment (calcination) again after the disintegration causes the surface modification of the disintegrated silica particles, greatly improving hygroscopicity and dispersibility in resin. The resin composition obtained in this manner including silica particles provides good injectability and filterability when used for an underfill material for semiconductors and an in-plane spacer or sealing spacer of liquid crystal displays.

Method for producing disintegrated silica particles

Producing a silica particle by inhibiting the generation of incompletely reacted materials such as oligomers which have not been grown to the silica particles having the intended particle size. A dispersion liquid of a silica particle is produced by simultaneously adding, to a liquid substantially consisting of an organic solvent, a liquid containing silane alkoxide and a liquid containing an alkali catalyst and water to cause hydrolysis and polycondensations to produce a silica particle. The variation rate of the mole ratio of the alkali catalyst to silane alkoxide in the reaction system for a period from the start to the end of the reaction relative to the initial mole ratio is 0.90 to 1.10; and the variation rate of the mole ratio of water to silane alkoxide for a period from the start to the end of the reaction relative to the initial mole ratio is 0.90 to 1.10.

Silica particle dispersion and production method of the same

Provided is a silica-based polishing particle which can polish and flatten the surface of a substrate at a sufficient polishing rate with generation of scratches prevented, and successfully prevents generation of particle residues on a substrate after polishing. A silica-based polishing particle with a three-dimensional polycondensation structure containing an alkoxy group, wherein the particle has an average particle diameter (d) of 5 to 300 nm, an aspect ratio of 1.00 or more and 1.20 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

Silica-based polishing particle and abrasive

Provided is a silica-based polishing particle, particularly suitable for primary polishing, which provides a high polishing rate on the surface of a substrate and which prevents particle residues on the substrate after polishing, and an abrasive including the silica-based polishing particle. A silica-based polishing particle with a three-dimensional polycondensation structure containing an alkoxy group, wherein the particle has an average particle diameter (d) of 5 to 300 nm, an aspect ratio of more than 1.20 and 5.00 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

A coating liquid for forming a low dielectric constant amorphous silica-based coating film with a dielectric constant of 3.0 or below and a film strength (Young's modulus) of 3.0 GPa or more, and also having a smooth surface with an excellent hydrophobicity. The coating liquid contains (1) a silicon compound obtained by hydrolyzing bis(trialkoxysilyl)alkane (BTASA) and alkoxysilane (AS) in the presence of tetraalkylammoniumhydroxide (TAAOH), or (2) a silicon compound obtained by hydrolyzing bis(trialkoxysilyl)alkane (BTASA), alkoxysilane (AS) and tetraalkylorthosilicate (TAOS) in the presence of tetraalkylammoniumhydroxide (TAAOH).

Coating liquid for forming low dielectric constant amorphous silica-based coating film and the coating film obtained from the same

A method of forming on a substrate an amorphous silica-based coating film having a low dielectric constant of 3.0 or below and a film strength (Young's modulus) of 3.0 GPa or more, which comprises, as a typical one, the steps of; (a) coating on the substrate a liquid composition containing hydrolysate of an organic silicon compound or compounds hydrolyzed in the presence of tetraalkylammonium hydroxide (TAAOH); (b) setting the substrate in a chamber and then drying a coating film formed on the substrate at a temperature in the range from 25 to 340&#xb0; C.; (c) heating the coating film at a temperature in the range from 105 to 450&#xb0; C. with introduction of a superheated steam having such a temperature into the chamber, and (d) curing the coating film at a temperature in the range from 350 to 450&#xb0; C. with introduction of a nitrogen gas into the chamber.

Method for forming amorphous silica-based coating film with low dielectric constant and thus obtained amorphous silica-based coating film

The present invention relates to a coating liquid for forming an amorphous silica-based coating film with a low dielectric constant of 2.5 or below and the Young's modulus of 6.0 GPa or more and having excellent hydrophobic property, and to a method of preparing the same. The coating liquid may contain a silicon compound obtained by hydrolyzing tetraalkyl ortho silicate (TAOS) and specific alkoxysilane (AS) in the presence of tetraalkyl ammonium hydroxide (TAAOH), or may contain a silicon compound obtained by hydrolyzing or partially hydrolyzing tetraalkyl ortho silicate (TAOS) in the presence of tetraalkyl ammonium hydroxide (TAAOH), mixing the reaction product with specific alkoxysilane or a hydrolysate or a partial hydrolysate thereof, and hydrolyzing all or a portion of the mixture according to the necessity. In addition, the coating liquid is prepared by mixing components described above at a specific ratio and under specific process conditions.

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Fukuoka, Japan

Miki Egami