Applied Materials, Inc.

Steag Hamatech Ag

Applied Mateials, Inc.

Ske Technology Corp.

Mikhail Mazur

Ke Ling Lee

Ken Lee

Robert Martinson

Robert M Martinson

A plasma sputtering system is described. A substrate handling system thereof places an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask onto a tray in a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks are moved on the tray to a sputtering chamber where the substrate is sputter coated. The substrate handing system removes the processec substrate and accompanying inner and outer masks from the tray in the loadlock to an external substrate change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition.

System and method for transporting and sputter coating a substrate in a sputter deposition system

A universal coupler for a self aligning linear actuator for a valve assembly. The self aligning linear actuator utilizes a drive screw or other threaded drive means to drive a plunger for a throttle valve. The drive screw rotates within a frame while a threaded collar or ball screw coupled to a drive coupler drives the plunger parallel to the drive screw. The universal coupler relieves any bending strain induced by misalignment between the drive screw and the plunger by allowing pivotal movement of the drive coupler relative to the drive screw.

Universal coupler for a self aligning linear actuator

A substrate handling system auxiliary to a plasma sputtering system is described. The substrate handling system inserts an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask into a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks then are moved to a sputtering chamber where the substrate is coated by sputtering. Subsequently, the substrate handling system moves a processed substrate, and its accompanying inner mask and an outer mask, from the loadlock to an external disk change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Subsequently, another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition, so that the masks can be gripped without causing particulate contamination. A coated surface of the inner mask and outer mask has numerous asperities to trap sputtered material and reduce contamination.

System and method for handling and masking a substrate in a sputter deposition system

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San Francisco, CA, United States of America

Mikhail Mazur