Corning Incorporated

Mike Xu Ouyang

Laura A Weller-Brophy

Gang Chen

Lyle David Kinney

Steven Bruce Dawes

Chung-En Zah

Christopher Morton Lee

Michael David Harris

Darol Chamberlain

Lawrence George Mann

Emmannuel C Onyiriuka

Martin (Hai) Hu

Peter J McNeilly

Emmanuel C Onyiriuka

Multilayer anti-reflective coatings having four or more layers are disclosed. In one aspect, the multilayer anti-reflective coating comprises a first layer having a refractive index n, where n&#x3c;1.4, and an optical thickness of (0.25&#xb1;5%) &#x3bb;nm; a second layer adjacent to the first layer, the second layer having a refractive index n, where n&#x2267;1.8, and an optical thickness of (0.5&#xb1;5%) &#x3bb;nm; a third layer adjacent to the second layer, the third layer having a refractive index n, where 1.4&#x2266;n&#x3c;1.6, and an optical thickness of (0.1&#xb1;5%) &#x3bb;nm; and a fourth layer adjacent to the third layer, the fourth layer having a refractive index n, where n&#x2267;1.8, and an optical thickness of (0.05&#xb1;10%) &#x3bb;nm; where &#x3bb;is a wavelength in the visible light range.

Anti-reflective coating for optical windows and elements

The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a substrate with one or a plurality of optical, opto-electronic, electronic or micro-electromechanical ('MEMS') elements either singly or in combination that are located on a substrate; a covering having a top part and an extension extending a distance from the top part from the top part, an adhesive that is used to bond the extension portion of the covering to the substrate; and a sealing agent for hermetically sealing the area where the covering extension is bonded to the substrate. In the method of the invention the sealing agent is applied using atomic layer deposition techniques.

Hermetic seals for micro-electromechanical system devices

A method of passivating an edge-emitting semiconductor diode laser and the resultant product. Laser bars are cleaved in air from a wafer containing multiple laser bars. The bars are placed into a vacuum processing chamber in which two steps are performed without breaking vacuum. The first step includes cleaning the facets including removing the native oxide by, for example, a low-energy ion beam or by an electron cyclotron resonance (EAR) plasma containing hydrogen and possibly argon or xenon with the bars being negatively biased. The second step includes coating the cleaned facets with a thin passivation layer of hydrogenated amorphous silicon (a-Si:H), whereby the facets are coating by the passivation layer without an intervening oxide. A low oxygen partial pressure of no more than 10 Torr is maintained between the cleaning and deposition, both of which preferably are done in the same chamber. Also preferably, anti-reflective or highly reflective coatings are deposited on the facets without returning the laser bars to air.

Passivation of semiconductor laser facets

The present invention relates to a tunable optical device that includes an optical fiber device having optical properties that vary with temperature and a heater . The heater is thermally coupled to the optical fiber device . The heater includes a metal layer and two electrical contacts that are electrically connected to the metal layer . The electrical contacts are spaced apart from one another along the metal layer . The electrical resistance of the portion of the metal layer between the contacts varies with temperature and serves as a resistive heater. The invention also includes a controller that is electrically connected to the heater . The controller provides electrical power to the heater and measures the electrical voltage across the heater . The controller compares the measured electrical voltage to a pre-selected reference value. The controller then regulates the amount of electrical current supplied to the heater . By regulating the amount of electrical current supplied to the heater the temperature of the heater is controlled.

Thermally tunable optical devices

A copper-gallium alloy is deposited on a nonconductive substrate, such as glass, ceramic, or polymeric material, to provide a conductor to which solder will readily adhere, such that electrical contacts to photonic and electrical components can be made. The copper-gallium thin film can also be used to provide a surface for solder sealing a component within a hermetically sealed enclosure. In a preferred embodiment, the copper-gallium alloy was from about 1 to about 40 percent gallium to about 99 to about 60 percent copper and was deposited to a thickness of from about 400 nanometers to about 3 microns. The copper-gallium film is deposited utilizing sputtering or electron beam deposition equipment.

Solderable thin film

Growing community of inventors

Painted Post, NY, United States of America

Mike Xu Ouyang