Robert Boschgmbh

Mike Schwarz

Thomas Friedrich

Arne Dannenberg

Volkmar Senz

Friedjof Heuck

Helmut Grutzeck

Daniel Haug

Jochen Franz

Peter Schmollngruber

Heiko Stahl

Robert Maul

Andreas Duell

Timo Lindemann

Stefan Zehringer

Hans-Peter Baer

Michaela Mitschke

Stephan Oppl

Ferenc Lukacs

Timon Brueckner

Soeren Zimmermann

Tamas Dögei

Daniel Kaercher

Pascal Gieschke

Valentina Kramer-Sinzinger

A MEMS element is provided. The MEMS element includes: a substrate; a first passivation layer arranged on the substrate; a metal layer arranged on the first passivation layer; a second passivation layer arranged on the metal layer and on the first passivation layer; and a punch element, an electrically conductive diffusion-blocking layer being arranged on the punch element and on the second passivation layer, a first bonding element being arranged on the punch element.

Bond structures on MEMS element and ASIC element

A MEMS sensor. The MEMS sensor includes a deflectably situated functional layer, a conversion device for converting a deflection of the functional layer into an electrical signal, the conversion device including at least one electrical element, the at least one electrical element being at least partially electrically connected to a first area, and the first area being at least partially electrically connected to a second area, and the first and second areas and/or the first area and the at least one electrical element being electrically operable in a reverse direction and a forward direction, and a control unit, the control unit being designed to at least partially operate the at least one electrical element and the first area and/or the first area and the second area in the forward direction to provide thermal energy.

MEMS sensor as well as method for operating a mems sensor

A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.

Micromechanical sensor device and corresponding manufacturing method

A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.

Method for manufacturing a substrate having a region mechanically decoupled from a support, method for manufacturing at least one spring, and a substrate

A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

Micromechanical device and method for manufacturing a micromechanical device

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Linearized micromechanical sensor

A micromechanical pressure sensor, having&#x2014;a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and&#x2014;a pressure sensor frame; and&#x2014;a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

Micromechanical pressure sensor

A sensor apparatus having a sensor unit. The sensor unit including pixel assemblages on a substrate upper side of a substrate located on a lower side of the sensor unit; a cap, on the substrate upper side, which covers the pixel assemblages, a cavity being formed between the substrate upper side and the cap; a plurality of filters that are transparent to wavelength regions that differ from one another, exactly one pixel assemblage being associated with each filter; and the filters being on the cap so that the infrared radiation propagated through an absorption gap of the sensor apparatus and the upper side of the sensor unit is detectable, through the respective filter, by the pixel assemblage associated with the respective filter; and a coating made of a light-absorbing and/or light-reflecting material being configured at least locally on a part of the cap which is not covered by the filters.

Sensor device for measuring a fluid concentration, and use of the sensor device

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

A micromechanical system including a sensitive element, the system including a first area in which the sensitive element is situated, and a second area which at least partially surrounds the first area. Furthermore, the system includes a holding element having an elastic property, which joins the first area to the second area, and a joining material, with the aid of which the second area may be joined to a substrate. A spacing area is provided between the first area and the second area. The joining material extends into the spacing area so that a possible movement of the first area caused by the elastic property of the holding element is limited.

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Kusterdingen, Germany

Mike Schwarz