Koninklijke Philips Corporation N.v.

Philips Image Guided Therapy Corporation

Mike Lavy

Wojtek Sudol

Anjali Saini

Stephen Charles Davies

William J Ossmann

Hyunggyun Lee

Junho Song

An imaging assembly for an intraluminal device is provided. In one embodiment, the imaging assembly includes: an array of ultrasound transducer elements spaced apart by air kerfs; a plurality of buffer elements surrounding the array of ultrasound transducer elements, wherein the plurality of buffer elements are spaced apart by gaps; and a sealing material filling portions of the gaps between the plurality of buffer elements.

Transducer arrays with air kerfs for intraluminal imaging

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

Ultrasound imaging device with thermally conductive plate

A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array () of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit () adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate () adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.

Growing community of inventors

Stoneham, MA, United States of America

Mike Lavy