Berliner Glas Kgaa Herbert Kubatz Gmbh & Co.

Mike Fischer

Ralf Hammer

Gregor Hasper

Volker Schmidt

Stefan Hoescheler

Method of manufacturing holding plate () including ceramic material of several chemical elements and configured for holding apparatus () for holding a component by electrostatic forces or vacuum, includes the steps of material removal from holding plate () by laser ablation, wherein by laser irradiation () protrusions () are formed on holding plate (), end faces () of which span a carrier surface for the component, and surface modification of holding plate () by laser irradiation (), wherein irradiation parameters of laser irradiation () are set such that at least one of the chemical elements of the ceramic material is enriched on the surface of holding plate (). A method is also described of manufacturing holding apparatus () for holding a component by electrostatic forces or vacuum, holding plate () which is produced with the inventive method, and holding apparatus () with at least one holding plate ().

Method of manufacturing a holding plate, in particular for a clamp for holding wafers

A method for processing a holding plate () of a clamping device (in particular clamp wafer chuck) for holding a component, in particular a wafer, wherein the holding plate () has a SiC-based surface () on which at least one protruding, SiC-based surface element () is formed, includes the steps of locally limited heating of the holding plate () in a predetermined surface section and creating the surface element () at the predetermined surface section by chemical vapor deposition, in particular by means of laser CVD. Applications of the method exist in repairing a holding plate () of a clamping device or manufacturing a holding plate () of a clamping device. Furthermore, a holding plate of a clamping device for holding a component, in particular a wafer, is described.

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Berlin, Germany

Mike Fischer