Cascade Microtech, Inc.

Sharp Laboratories of America, Inc

Mike Andrews

Leonard A Hayden

John T Martin

K Reed Gleason

Tim Lesher

Eric W Strid

Scott H Rumbaugh

John L Dunklee

Amr M E Safwat

Richard Lynn Campbell

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Probe for testing a device under test

The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices.

Method of assembling a wafer probe

The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.

Wafer probe

A probe with integral balun enables connecting a device utilizing differential signals to a source or a sink of single ended signals.

Differential signal probe with integral balun

Shielded probe for testing a device under test

A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.

A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Probe for combined signals

A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Growing community of inventors

Cornelius, OR, United States of America

Mike Andrews