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Mika Silvennoinen

Timo Koivuluoma

Jorma Manninen

Jani Hakala

Joni Pakarinen

Mika Sares

Kjell Ingman

Mika Vartiainen

Matti Kauranen

Mattl Kauranen

Heikki Mörsky

A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Cooling arrangement

A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

Heatsink assembly, method of manufacturing a heatsink assembly, and an electrical device

A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.

Power electronic module

A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Power electronics module and a method of producing a power electronics module

A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.

Power electronics module

A frequency converter unit includes a unit body, input bus bar means and output bus bar means. The input bus bar means have a plurality of input side bus bars spaced apart in a first direction, and the output bus bar means have a plurality of output side bus bars spaced apart in the first direction, which is perpendicular to an installation direction of the frequency converter unit. Each of the plurality of input side bus bars and the plurality of output side bus bars includes an aperture configured to connect the bus bar to a counterpart contact in a frame with a bolt-nut connection.

Frequency converter unit

Frequency converter

A power electronic apparatus with cooling arrangement comprises a housing () that accommodates the power electronic components (). At least two adjacent axial fans () are connected to the housing () for inducing an airflow from outside into the housing () in order to cool the power electronic components (). Furthermore, at least one pair of said adjacent fans () is disposed at an angle &#x3b1; with respect to each other in order to reduce noise caused by the fans. Such a cooling arrangement provides a power electronic apparatus with effective cooling in compact size and also having an acceptable level of noise.

Power electronic apparatus with cooling arrangement

A power electronic device with cooling arrangement includes a housing that accommodates power electronic components. At least two adjacent axial fans are connected to the housing for inducing an airflow from outside into the housing in order to cool the power electronic components. Furthermore, the device can include a separating wall that extends outside the housing from between the at least two adjacent axial fans in order to reduce noise caused by the fans. Such a cooling arrangement can provide a power electronic device with effective cooling in compact size and also having an acceptable level of noise.

Power electronic apparatuses with cooling arrangements

An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Electric drive

An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Arrangement for a motor controller

The invention relates to an environmental fuse, an actuator and to an associated method for protecting the actuator from failure in a specific operating environment. The environmental fuse then comprises a sensor member for detecting any change in the environment deviating from the tolerance allowed by a specific standard, and a functional member comprising functional means for limiting or interrupting the input to said actuator and/or for giving an alarm. The actuator may also comprise an environmental fuse.

Environmental fuse

The present invention relates to a cooling device for an electronic apparatus comprising: a cooling element to be connected to an electronic component for receiving the heat load generated by the electronic component, an inlet port, an outlet port and a fan for bringing air to flow from the inlet port via the cooling element to the outlet port to cool the cooling element by means of the air flow. In order to achieve a simple device improving the reliability the cooling device comprises at least one return channel, through which some of the air flowing from the cooling element towards the outlet port is conducted to an electronic space to cool the electronic space, and that a forepart of the return channel is arranged in a place where the air flow from the cooling element towards the outlet port is colder than the air flowing from the cooling element on average. The invention also relates to a cooling method.

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Espoo, Finland

Mika Silvennoinen