Fujitsu Semiconductor Limited

Mika Sakamoto

Kazuo Teshirogi

Yuzo Shimobeppu

Kazuhiro Yoshimoto

Hironori Fukaya

Yoshiaki Shinjo

Kazuyuki Uragou

Masaya Tazawa

A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Method for manufacturing semiconductor device and surface protective tape

A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.

Method of manufacturing semiconductor device with spraying fluid

Growing community of inventors

Yokohama, Japan

Mika Sakamoto