Tactotek Oy

Mika Paani

Mikko Heikkinen

Jarmo Sääski

Tomi Simula

Tapio Rautio

Tero Heikkinen

Outi Rusanen

Johanna Juvani

Miikka Kärnä

Ronald H Haag

Marko Suo-Anttila

Jan Tillonen

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Multilayer structure and related method of manufacture for electronics

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

Method of manufacture of a structure and structure

A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.

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Oulunsalo, Finland

Mika Paani