Confidex Oy

Miika Pylvänäinen

Heikki Ahokas

Will Deng

Matti Ritamäki

Eveliina Koski

The present invention relates to an RFID tag () that has a front side and a back side. The RFID tag () comprises a printable surface (), an antenna () and an integrated circuit on a chip () electrically connected to the antenna (). The RFID tag comprises a dielectric substrate (), a dielectric layer () and a ground plane () under the substrate (). The substrate () has a first side and a second side. The substrate () comprises an antenna () on the first side of the substrate (). The antenna () and the ground plane () are configured to overlap. The substrate () is folded over at least one edge () of the dielectric layer () in such a manner that the ground plane () is configured to cover the antenna () on the back side of the RFID tag ().

RFID tag

An RFID tag () comprises a substrate (), an inlay (), an antenna () and an integrated circuit on a chip () coupled to the antenna (). The substrate () has a front surface (), a back surface (), a first side edge () and a second side edge (). The inlay () comprises the antenna () and has a fold () that is configured to fold over one side edge () of the substrate () from the front surface () to the back surface (). At least the inlay () comprises at least one opening ().

An RFID transponder, comprising an antenna, comprising a radiating element an IC, and a ground plane arranged under the radiating element, the ground plane being solid without openings. The radiating element comprises a near field communication section extending over the edge of the ground plane for enabling near field communication of the antenna by the ground plane from backside of the RFID transponder.

RFID transponder

An RFID transponder web, comprising a support substrate, and a series of the RFID transponders arranged on said support substrate such that there is a distance (D) between two successive RFID transponders. The transponder(s) have a transponder thickness (T). The RFID transponder web further comprises a spacer arranged on the support substrate, at least on the section of the support substrate that lies between the successive RFID transponders and extends from a first edge of the support substrate to another edge of said support substrate. A through cut is arranged between the spacer and the next RFID transponder, or between two spacer parts. The through cut allows the spacer to be bent away from said next RFID transponder, or to bent away said two spacer parts from each other. Alternatively, the support substrate is made of a flexible and elastic material.

RFID transponder web

An RFID transponder (), comprising a printable surface (), an antenna element (), an IC (), and a ground plane () arranged under the antenna element (). The ground plane () comprises one or more opening(s) () through said ground plane () for enabling near field communication through the ground plane ().

Growing community of inventors

Ylöjärvi, Finland

Miika Pylvänäinen