Nitto-denko Corporation

Nitto Shinko Corporation

Nitto Electric Industrial Co., Ltd.

Miho Yamaguchi

Yuji Hotta

Masayuki Hodono

Fumiteru Asai

Shinji Inokuchi

Kunio Nagasaki

Akiko Matsumura

Kenichi Fujikawa

Yozo Nagai

Mitsuyoshi Shirai

Kouji Furuuchi

Ichiro Suehiro

Yoshitada Morikawa

Yoshiharu Hatakeyama

Yoshiaki Mitsuoka

Michio Komoto

Akihiro Oohashi

Yuji Yamagishi

Takashi Yamamoto

Katsuya Kume

Sadahito Misumi

Izumi Ozeki

Tomohiro Omure

Kazuo Ouchi

Hirofumi Ebe

Satoshi Ito

Shoichiro Saito

Makoto Fujihara

Eiichi Imoto

Toshinobu Hoshino

Toshiaki Okuno

Hitomi Shigyo

Masakazu Morimoto

Hiroshi Matsuo

Takatoshi Hamada

Yuki Kato

Tomoya Matsuda

Yuko Yamamoto

Katsuyuki Nakabayashi

Hirofumi Ono

Akiko Kitayama

Provided is a method for producing a sintered body that forms a rare-earth permanent magnet, has a single sintered structure and an arbitrary shape, and has easy magnetization axis orientations of different directions applied to the magnet material particles in a plurality of arbitrary regions. This method forms a three-dimensional first molded article from a composite material formed by mixing a resin material and magnet material particles containing a rare-earth substance. The first molded article is then subjected to a deforming force and a second molded article is formed in which the orientation direction of the easy magnetization axis of the magnet material particles in at least the one section of the horizontal cross-section is changed to a direction which differs from the orientation direction of the first molded article. The second molded article is heated to a sintering temperature and kept at the temperature for a period of time.

Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientation

The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.

Thermally conductive polymer composition and thermally conductive molded object

The present invention provides, as an aluminum nitride powder excellent in the water resistance, an aluminum nitride powder subjected to a surface treatment with a predetermined organic compound. The present invention also provides a resin composition including the aluminum nitride powder and a resin, and a thermal conductive molded article obtained by molding the resin composition.

Aluminum nitride powder, resin composition, and thermally conductive molded object

The present invention provides a resin porous membrane with an adhesive layer that exhibits excellent bonding precision and can be bonded to an adherend while maintaining the gas permeability of the porous membrane even when the porous membrane is small, and a method for producing the resin porous membrane with the adhesive layer. The present invention also provides the filter member including the resin porous membrane with the adhesive layer.

Method for producing resin porous membrane with adhesive layer, resin porous membrane with adhesive layer, and filter member

An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.

Methods of manufacturing optical waveguide film and optical substrate

Optical substrate having a supporting substrate and an optical waveguide film adhesively bonded to the supporting substrate

Optical waveguide film, optical substrate, and methods for manufacturing the same

A photosensitive epoxy resin adhesive composition which is capable of forming a pattern by exposure to light through a photomask and development, and which, even after having formed a pattern in that manner, may still exhibit high adhesiveness when heated while keeping its pattern as such, as well as a photosensitive adhesive film which comprises the photosensitive epoxy resin adhesive composition. The photosensitive epoxy resin adhesive composition comprises an epoxy resin and a photo-acid generator, wherein the epoxy resin comprises a polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.

Photosensitive epoxy resin adhesive composition and use thereof

An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.

Method of manufacturing an anisotropic conductive film

A porous adhesive sheethaving plural through holesrunning in about parallel with each other in the thickness direction A of an adhesive organic film, wherein the through holes have about congruent sections in the diameter direction from one openingto the other openingand a production method thereof, and a semiconductor wafer with a porous adhesive sheet, which includes a semiconductor waferhaving an electrode, the porous adhesive sheetadhered to the semiconductor wafer, and a conductive partformed by filling a through holelocated on the electrodewith a conductive material, and a production method thereof are provided.

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof

An anisotropic conductive film comprising an insulating film and plural conductive paths ( ), wherein the plural conductive paths are insulated from each other and penetrate the insulating film in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path capable of contact with an electrode of a semiconductor element and a circuit of a circuit board has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.

Anisotropic conductive film and production method thereof

Anisotropic conductive film

A semiconductor device containing a circuit board, an anisotropic conductive film and a semiconductor element electrically connected to the circuit board via the anisotropic conductive film, wherein the anisotropic conductive film contains a film substrate made from an insulating resin and plural conductive paths insulated from each other, which paths are disposed in and through the film substrate in the thickness direction, and wherein a gap is formed between the surface on the circuit board side of the film substrate and the board surface of the circuit board. The connection part between the anisotropic conductive film and the circuit board, as well as the connection part between the anisotropic conductive film and the semiconductor element do not suffer from interface destruction even when the device is used in an environment associated with radical temperature changes. Thus, a semiconductor device having high connection reliability can be obtained.

Anisotropic conductive film-containing device

Growing community of inventors

Ibaraki, Japan

Miho Yamaguchi