Litton Systems, Inc.

Miguel M Saldana

Michael Jude Iosue

Jay Scott Tucker

Niels F Jacksen

Mating faces of a microchannel plate (MCP) () and a multi-layer ceramic body () unit are deposited with a thin film having protuberances () using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP () and multi-layer ceramic body () unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP () and the multi-layer ceramic body unit ().

Bonding methods for microchannel plates

A microchannel plate (MCP) () and a dielectric insulator () are deposited with a thin film () using a suitable metal selected for optimum diffusion. The metallized MCP () and dielectric insulator () are then aligned and placed in a bonding fixture () that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture () is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP () and the dielectric insulator ().

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Tempe, AZ, United States of America

Miguel M Saldana