Siemens Aktiengesellschaft

Siemens Healthcare Gmbh

Siemens Healthineers Ag

Miguel Labayen De Inza

Thorsten Ergler

Jan Wrege

Daniel Niederlöhner

Matthias Strassburg

Christian Schröter

Björn Kreisler

Steffen Kappler

Stefan Wirth

Peter Hackenschmied

Edgar Göderer

Mario Reinwand

Ludwig Danzer

Fabrice Dierre

Karl Stierstorfer

Edgar Goederer

Bjoern Kreisler

Christian Schroeter

Harald Geyer

Kurt Stadlthanner

Stefan Woelfel

Peter Sievers

Justus Tonn

Caroline Blenk

Markus Sicker

Robert John Ellwood

A method for positioning sensor units in a detector module for a CT device includes arranging a connecting layer on a positioning substrate. Sensor units and readout units, forming sensor readout arrangements, are positioned relative to the positioning substrate. The sensor units are temporarily connected to the positioning substrate at a fixed position by the connecting layer. Electronics boards are positioned, and conductive connections are produced between the electronics boards and contacts of the readout units, such that sensor boards are obtained. The sensor units are then positioned by the positioning substrate relative to a module carrier and are attached to the module carrier, such that a detector module is obtained.

Positioning of sensor units using a positioning substrate

An inventive assembly method is for the production of an x-ray detector. In an embodiment, the method includes positioning a plurality of sensor surface elements, formed from an x-ray radiation-sensitive material, on an assembly carrier; placing an interposer on a contact side of each of the plurality of sensor surface elements, divided into a plurality of pixels and arranged opposite the assembly carrier, such that respective contact elements arranged on a mating contact side of the interposer, facing towards respective ones of the plurality of sensor surface elements, each contact a pixel; and respectively putting evaluation circuits on a circuit side of the interposer, opposite to the mating contact side of the interposer, for each of the plurality of sensor surface elements.

Assembly method for producing an x-ray detector, x-ray detector and x-ray device

A counting X-ray detector includes, in a stacked array, a converter material for converting X-ray radiation into electric charges and an electrode. In an embodiment, the electrode is electrically conductively connected to the converter material. The electrode is designed to be at least partly transparent. In an embodiment, the electrode includes: an electrically conductive contact layer, an electrically conductive first intermediate layer, an electrically conductive high voltage layer, a second intermediate layer and an electrically conductive heating layer.

X-ray detector with heating layer on converter material

An X-ray detector includes a stack arrangement with a scattered radiation grid and a planar converter element including a first surface and a second surface. The converter element includes a first electrode embodied on the first surface and a pixelated second electrode with two adjacent first electrode elements. The two adjacent first electrode elements include a first width and a first length and the two adjacent first electrode elements are embodied the second surface opposite the first surface. The scattered radiation grid includes a grid wall with a thickness along the boundary between the two adjacent first electrode elements. The grid wall is arranged to be substantially perpendicular on the first surface and, in a projection, substantially parallel to the direction of incidence of the radiation and to the surface normal of the first surface. The grid wall at least partially overlaps the two adjacent first electrode elements.

X-ray detector with an arrangement of a pixelated second electrode and a scattered radiation grid

An X-ray detector includes a direct-converting converter element, an evaluation unit, and an intermediate layer arranged flat between the direct-converting converter element and the evaluation unit. In an embodiment, the intermediate layer is non-transparent for visible, infrared, or ultraviolet light.

X-ray detector with non-transparent intermediate layer

A sensor board for a detector module is disclosed. It includes, in a stack construction, at least one reader unit and a sensor layer arranged spaced from the reader unit in the direction of the stack. A gap formed by the spacing between the sensor layer and the reader unit is filled with a cured filling material such that at least one edge region of the sensor layer is free of the filling material. Furthermore, a method is disclosed for manufacturing a corresponding sensor board, and a detector module is disclosed for an X-ray detector having a number of sensor boards which are arranged to be mutually adjacent on a module carrier.

Sensor board for a detector module

A counting x-ray detector includes, in a stack arrangement, a converter element for conversion of x-ray radiation into electrical charges and an electrode. The electrode is connected to the converter element electrically-conductively in a planar manner. The electrode is embodied at least partly transparently. The electrode includes the following layers: an electrically-conductive contact layer, an electrically-conductive first intermediate layer, an electrically-conductive high-voltage layer, and an illumination layer.

Xray detector with illumination layer on converter element

An X-ray detector includes an anti-scatter grid, an electrode and a converter element for converting X-rays into electrical charges in a stacking arrangement. In an embodiment, the stacking arrangement is externally enclosed by a protective element. The protective element extends in the stacking direction such that an enclosed area is at least arranged between the anti-scatter grid and the converter element and along the entire height of the converter element in the stacking direction. An adhesive element is arranged between the anti-scatter grid and the electrode.

X-ray detector with protective element and adhesive element

An imaging device for electromagnetic radiation, especially for x-ray and/or gamma radiation, is disclosed. In an embodiment, the imaging device includes a layering including a number of detection elements, a number of read-out boards and a base board. Each of the detection elements is electrically contacted with a respective read-out board via a plurality of first solder contacts. Each read-out board includes a plurality of through-contacts and is electrically contacted with the base board via a plurality of second solder contacts.

Imaging device for electromagnetic radiation

A method is disclosed for detecting x-rays using an x-ray detector which includes a direct-conversion semiconductor detector element. Additional radiation is supplied to the semiconductor detector element using a radiation source, and the supply of the additional radiation is controlled and/or regulated on the basis of a specified target value. In at least one embodiment, the target value can be specified in a variable manner over time as a sequence of target values. An x-ray detector system is further disclosed, with which the method can be carried out.

Detection of x-rays, and x-ray detector system

A method is disclosed for producing a hybrid, incorporable into a sensor board, for a detector module including a plurality of reader units. An embodiment of the method includes positioning the reader units in a stacked construction, each on a common sensor layer. The method further includes, after all of the reader units are positioned, fixing the reader units together on the sensor layer, thereby forming the hybrid. An embodiment of the invention further relates to a detector module for an X-ray detector including a number of sensor boards arranged adjacent to one another on a module carrier. The sensor boards are produced by an embodiment of the method.

Method for producing a sensor board for a detector module

A method is disclosed for producing an electronic component including at least two functional layers. One of the functional layers has channels, open towards the other functional layer, which run inwards from one edge of the functional layer. Further, an adhesive which contacts the adjacent functional layers is located in at least one of the channels, and a hardening of the adhesive is effected by introducing UV radiation via the channels. Furthermore an electronic component is also disclosed, including at least two adjacent functional layers adhesively bonded together in sandwich-like fashion, wherein at least one of the functional layers has channels which extend inwards from at least one edge of the functional layer and an adhesive hardened by UV radiation is arranged in the channels. A detector element of a radiation detector including such an electronic component and a radiation detector having such a detector element are also disclosed.

Method for producing an electronic component of sandwich-like construction, electronic component, detector element and radiation detector

A direct-converting x-ray radiation detector is disclosed for detecting x-ray radiation, in particular for use in a CT system. In an embodiment, the detector includes a semiconductor material used for detecting the x-ray radiation; at least one collimator; and at least one radiation source, to irradiate the semiconductor material with additional radiation. In at least one embodiment, the at least one collimator includes at least one reflection layer on a side facing the semiconductor material, on which the additional radiation is reflected to the semiconductor material. In another embodiment, a CT system including the direct-converting x-ray radiation detector, and a method for detecting incident x-ray radiation via a direct-converting x-ray radiation detector, in particular for use in a CT system, are disclosed.

X-ray radiation detector, CT system and related method

A direct-converting x-ray radiation detector is disclosed for detecting x-ray radiation, at least including a semiconductor used to detect x-ray radiation and at least one electrode attached to the semiconductor. In an embodiment, the semiconductor and the at least one electrode are electrically conductively connected and the at least one electrode is designed to be transparent and electrically conductive. A CT system is further disclosed, at least including the direct-converting x-ray radiation detector.

Growing community of inventors

Forchheim, Germany

Miguel Labayen De Inza