Bitmain Technologies Limited

Micree Zhan

Tao Zhou

Tong Zou

Lei Zhang

Dan Su

Wenjie Cheng

Yonggang Sun

The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Chip heat dissipating structure, chip structure, circuit board and supercomputing device

Embodiments of the present application relates to a chip heat dissipation structure, a chip structure, a circuit board, and a supercomputing device, and the chip heat dissipation structure includes: a plating layer covering a wafer of the chip; where the plating layer includes a first metal layer, a second metal layer, and a third metal layer sequentially arranged. Three metal layers are added on a top of the chip by physical sputtering, so that a heat sink can be welded on the metal layers by a solder layer, and then the heat sink is fixed on the top of the chip; a main component of the solder layer is metal tin, and the metal layer have a higher thermal conductivity than an epoxy adhesive material mounted on a conventional heat sink.

Chip heat dissipation structure, chip structure, circuit board and supercomputing device

A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.

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Beijing, China

Micree Zhan