International Business Machines Corporation

Globalfoundries Inc.

Lenovo (Singapore) Pte. Ltd.

Michk Huang

Willie Theodore Davis, Jr

Matthew Stephen Kelly

Theron Lee Lewis

Larry G Pymento

Cliff Chen

Bolton Po-Yu Chen

Cliff Pei-Ju Chen

Patrick Chun-Chi Chen

James D Bielick

Yun Ting Lee

Celeste Zippetelli

Ben Chiu

An apparatus includes at least one grip mechanism of a rework nozzle configured to grip an electrical component that is soldered to a printed circuit board. The apparatus includes at least one spring coupled to at least one grip mechanism, where the spring is configured to move beyond a minimum threshold in response to an initiation of a melt of a solder that attaches the electrical component to the printed circuit board. The apparatus includes at least one sensor coupled to at least one spring, where the sensor is configured to detect the move of at least one spring beyond the minimum threshold. At least one sensor is configured to communicate at least one activate signal in response to detection of the move of one or more springs beyond the minimum threshold.

Sensor-based removal of a soldered device

Disclosed is an apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive. The apparatus includes a right-angled hook, a curved hook, a connecting body and an adjusting member. On one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface. On another side of the component, the curved hook protrudes into a second space between the component and the mounting surface. The connecting body connects the right-angled hook and the curved hook. In response to a thermal process, the adhesion of the adhesive is reduced, and an adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface. A method for detaching a component from a mounting surface is also disclosed.

Apparatus and method for detaching a component from a mounting surface

Disclosed is a monitoring and control device, applicable to an illumination apparatus. The illumination apparatus includes a lighting unit which outputs a signal representative of a status of the lighting unit. The illumination apparatus includes an apparatus identifier. The illumination apparatus includes: a monitoring circuit electrically coupled to the lighting unit, for receiving the signal and determining whether the illumination apparatus needs to be replaced in response to the signal satisfying a condition; a controller electrically coupled to the monitoring circuit; and a receiving/transmitting unit electrically coupled to the controller, wherein the controller controls the receiving/transmitting unit to transmit the apparatus identifier of the illumination apparatus to be replaced in response to the determination is affirmative. A method thereof is also disclosed.

Monitoring and control device and method for an illumination apparatus

An apparatus for a component rework nozzle includes a nozzle with a proximal end spaced apart from a distal end along an axis. The proximal end is sized to partially enclose a component during a component rework process. The component is disposed on a substrate by way of a plurality of solder joints. The apparatus includes an indentation defined in a side of the nozzle. The side of the nozzle is parallel to the axis. The indentation is shaped to maintain a separation between the nozzle and a neighboring component. The neighboring component is disposed adjacent to the component on the substrate. The apparatus includes a plurality of notches disposed on the proximal end of the nozzle. The plurality of notches are formed to balance heat distribution, during the component rework process, across the component.

Component rework nozzle

Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection apparatus cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus. Further provided is the protection apparatus for the thermal sensitive component mounted on the board during the thermal process.

Protecting a thermal sensitive component in a thermal process

Growing community of inventors

Taipei, Taiwan

Michk Huang