Goo Chemical Company, Ltd.

Michiya Higuchi

Yoshio Sakai

Nobuhito Hamada

Tokuzan Miyake

Fumito Suzuki

Hisashi Marusawa

Hiroko Daido

Tatsuya Kubo

Teppei Nishikawa

Chieko Inui

Koichi Ikegami

Noboru Kohiyama

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first &#x3b1;-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25&#xb0; C., and a second &#x3b1;-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25&#xb0; C.

Liquid solder resist composition and covered-printed wiring board

A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an &#x3b1;-hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The &#x3b1;-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.

Solder resist composition and covered printed wiring board

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.

A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an &#x3b1;-hydroxy alkylphenone-based photopolymerization initiator. 

Solder resist composition, and covered-printed wiring board

The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.

Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin

The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having; a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid.

Resin composition for masks

A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.

Growing community of inventors

Kyoto, Japan

Michiya Higuchi