Sony Corporation

Tdk Corporation

Joled Inc.

Jdi Design and Development G. K.

Michitoshi Tsuchiya

Makoto Noda

Takahiro Seki

Seiichiro Jinta

Manabu Kodate

Kenichi Izumi

Gaku Izumi

Hiroki Kato

Hisayoshi Watanabe

Koichi Otani

Masachika Hashino

Hideyuki Ukita

Tatsuhiro Nojima

Akio Miyajima

Masaichi Okubo

Mario Amatsuchi

Tsutomu Nishinaga

A self-luminous display panelin which self-luminous elementsare arranged on a plane, wherein each of the self-luminous elements includes: a pair of electrodesdisposed facing each other, an electrode of the pair of electrodes including a metal layerA; functional layersincluding a light emitting layer, disposed between the pair of electrodes; and a sealing layerthat covers the pair of electrodes and the functional layers from a direction. The self-luminous elements include a repaired self-luminous element′. The repaired self-luminous element includes a foreign object FO among the functional layers. The electrode including the metal layer has a high resistance portionsurrounding, in plan view, an area containing the foreign object, and has a thickened portionof the metal layer at an outer edge, in plan view, of the high resistance portion.

Self-luminous display panel and self-luminous display panel manufacturing method

A display unit includes a display panel and a first protective sheet. The display panel has a light-emitting surface. The first protective sheet is provided on the light-emitting surface. The first protective sheet provided in the display unit includes a first impact dispersion layer, a first strain relaxation layer, and a gel-like first impact absorption layer. The first impact dispersion layer has a pencil hardness of 3H or higher. The first strain relaxation layer has flexural strength and tensile strength both higher than the flexural strength and the tensile strength of the first impact dispersion layer. The gel-like first impact absorption layer has a thickness of a submillimeter order or more. The first impact absorption layer, the first strain relaxation layer, and the first impact dispersion layer are arranged in this order from the light-emitting surface.

Protective sheet, display unit, and electronic apparatus

A display unit comprising an organic layer between a light-emitting section portion of a first electrode layer and a light-emitting section portion of a second electrode layer. Light is emissible from within the organic layer. An aperture-defining insulating film is between a contact section of the first electrode layer and a gap section portion of the second electrode layer. The thickness of the gap section portion of the second electrode layer is greater than the thickness of the light-emitting section portion of the second electrode layer.

Display unit and electronic apparatus

A manufacturing method for a magnetic head includes the steps of: forming a structure on a lower shield, the structure including a lower gap, a main magnetic pole and first and second side gaps; forming first and second side shields; forming an upper gap; and forming an upper shield. In the step of forming the structure, an initial lower gap layer is formed on the lower shield, the initial lower gap layer including a pre-lower-gap portion, and two to-be-removed portions that are located on opposite sides of the pre-lower-gap portion. Then, a protrusion including the main magnetic pole and the first and second side gaps is formed on the pre-lower-gap portion. With the top surface of the protrusion covered with a mask, the initial lower gap layer is etched in part to thereby form the lower gap.

Method of manufacturing magnetic head for perpendicular magnetic recording with shield around main magnetic pole

A mounting substrate includes: a base substrate having a usable substrate region used as part of a product and an unusable substrate region to be discarded, the base substrate being subjected to soldering treatment in which the surface thereof is brought into contact with solder; and on-substrate members arranged on a soldering surface side, to be subjected to the soldering treatment, of the base substrate, the on-substrate members being in a state in which the surfaces have a wettability against solder upon soldering treatment. The on-substrate members are arranged in a non-contact portion with solder upon solder treatment in the unusable substrate region, in the usable substrate region, or in the non-contact portion and the usable substrate region. With this configuration, even if solder is stuck on the on-substrate members, any noxious material containing waste does not occur when the unusable substrate region is separated from the usable substrate region and is discarded.

Mounting substrate

Growing community of inventors

Tokyo, Japan

Michitoshi Tsuchiya