Denso Corporation

Michitake Kuroda

Kenji Chikuan

Yukihiro Kato

Tomohiro Yokochi

Hiroshi Nomura

Kiyoshi Otsuka

Hiroshi Uchigashima

Kan Kinouchi

Naohisa Niimi

Naoki Hasegawa

Haruhiko Miyagawa

Hiroshi Tanioku

A control device controls a water supply device that supplies irrigation water to an open farm field in which a plant grows. The control device includes a storage unit, a calculation unit, and an output unit. The storage unit stores an environment value of each of a plurality of divided areas obtained by dividing the farm field and weather forecast of the farm field. The calculation unit calculates, based on an environment value and the weather forecast, an irrigation schedule in which supply time and amount of the irrigation water individually supplied to each of the plurality of divided areas during the irrigation period are determined. The output unit outputs to the water supply device, a control signal to control supply and no supply of the irrigation water to each of the plurality of divided areas based on the irrigation schedule.

Control device and non-transitory computer readable medium

A pressure sensor includes a sensing element in a sensing chamber defined by two cases, one of which is crimped to the other. An internal pressure of the chamber is affected by a crimping force. In the manufacturing process of the pressure sensor, the internal pressure is monitored during crimping the cases. To monitor the internal pressure, the sensing element of the pressure sensor is used. An output signal of the sensing element is sent to a crimping machine. The crimping machine controls a crimping force based on the output signal.

Method for manufacturing sensor device

A semiconductor sensor chip is interposed between a sensor case and a housing. A first pressure is introduced from the sensor case and applied to a rear surface of the sensor chip, while a second pressure is introduced from the housing and applied to a front surface of the sensor chip. The sensor chip detects a pressure difference between the first and the second pressures and converts it into an electrical signal. The sensor chip is hermetically mounted in a depressed portion formed in the sensor case by charging a sealing material from holes formed around the depressed portion. The charging holes are positioned between terminals electrically connecting the sensor chip to an outside circuit to avoid enlarging the pressure sensor size by forming the charging holes.

Pressure sensor having semiconductor sensor chip

In a pressure sensor, a sensor element is mounted on a side of a first surface of a first case, and a second case having a cylindrical hollow portion is bonded to the first case to cover a part of a second surface of the first case, opposite to the first surface. Terminals are embedded in the first case to protrude from the second surface, and branch portions are branched from the terminals from an embedded portion in the first case to have exposed portions exposed to the second surface. A chip capacitor is mounted on the exposed portions on the second surface to be electrically connected to the exposed portions. In the pressure sensor, a diameter (D ) of the second surface of the first case is larger than an inner diameter (D ) of the hollow portion at a position where protrusion top ends of the terminals are positioned.

Pressure sensor and method for manufacturing the same

In order to form a hollow portion in a resin block after a molding operation, a projection for forming a hollow portion in a resin block is formed on an upper die. A front face of the projection is processed into a mirror finished face (smoothed flat face). Recess portions are formed in the front face of the projection. The position of the recess portions correspond to wire bonding regions of a lead frame. The lead frame is clamped between an upper die and a lower die. A molding resin is injected into a space between the upper and lower dies. As a result, an excellent wire bonding face can be secured at regions on the lead frame in correspondence with the recess portions.

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Ama-gun, Japan

Michitake Kuroda