Denso Corporation

Nippondenso Co., Ltd.

Nippon Soken, Inc.

Michitaka Hayashi

Masahito Imai

Hironobu Baba

Kazuhisa Ikeda

Masaki Takakuwa

Kazuhiko Koga

Hiroshi Okada

Toshiki Isogai

Toru Yamazaki

Toshikazu Itakura

Masato Ishihara

Kenji Hirano

Hiroshi Sugimoto

Masamoto Kawaguchi

Tokuhisa Nomura

Junzi Sugiura

Akiteru Takae

Akira Ishimaru

A vehicle theft prevention apparatus has a gyro, a G sensor, and a microcomputer in a case, thereby being capable of detecting a tilt of a vehicle and of detecting inertia applied to the vehicle. An outer surface of the case has a light detector that detects an approach of a suspicious person toward the vehicle. The vehicle theft prevention apparatus has an improved characteristic in terms of ease of installation in the vehicle and cost effectiveness.

Vehicle theft prevention apparatus

An antitheft apparatus for a vehicle has an inertia sensor, which is also used for an anti-lock braking system. An electronic control unit receives output signals from the inertia sensor and determines a possible vehicle theft when a detected vehicle condition (for example, vehicle acceleration) is larger than a threshold value.

Antitheft system for vehicle

A capacitance type humidity sensor includes: a detection substrate including a detection portion on a first side of the detection substrate; and a circuit board including a circuit portion. The detection portion detects humidity on the basis of capacitance change of the detection portion. The circuit portion processes the capacitance change as an electric signal. The detection substrate further includes a sensor pad on a second side of the detection substrate. The sensor pad is electrically connected to the detection portion through a conductor in a through hole of the detection substrate.

Physical quantity sensor and method for manufacturing the same

A pressure sensor has a sensor element portion for detecting pressure, and a pressure conduction portion connectable to a detected member and defining therein a conduction passage for conducting pressure from the detected member to the sensor element portion. A protective cap is detachably attached to the pressure conduction portion to cover a sealed portion where the pressure conduction portion is to be sealed to the detected member until before the pressure sensor is connected to the detected member. The protective cap has an opening portion through which the conduction passage communicates with an outside thereof. Accordingly, pressure characteristics can be checked without detaching the protective cap from the pressure conduction portion.

Pressure sensor and method for assembling the same

A pressure sensor portion having a pressure-responsive element for detecting gas pressure in reference to the atmospheric pressure is connected to a mounting body such as a canister mounted on a vehicle by means of a fragile connecting member. The connecting member breaks off to dismount the sensor device from the mounting body when a high impact due to an accidental collision or crash is imposed on the sensor device, and thereby an inlet port connected to the sensor portion for introducing gas pressure thereinto is prevented from being broken or damaged by such a collision impact. The fragile connecting member may include a tubular pipe formed integrally with a cover that hermetically closes an inner cavity of the sensor portion. A mounting bracket connected to the sensor portion via the fragile connecting member may be used to mount the sensor device on the mounting body.

Pressure sensor device having breakable mounting member

A pressure-adjusting device for adjusting an output of an integrated pressure sensor in which a silicon wafer is joined onto a seat that has pressure-adjusting passages formed therein, and which has formed in the silicon wafer a signal processing circuit with an adjusting resistor for each chip, a thin diaphragm for each chip and a piezo-resistance layer for each chip. The pressure-adjusting device includes a pressure-setting stage on which the seat is placed, the pressure setting stage having pressure-adjusting passages formed therein to adjust a pressure exerted on the respective thin diaphragm via the pressure-adjusting passages formed in the seat. A holding member is arranged on the pressure-setting stage as to surround at least an outer periphery of the seat. A first elastic air-tight member is arranged on the pressure-setting stage as to surround the outer periphery of the seat and be held compressed by the pressure-setting stage and by the holding member. A second elastic air-tight member is arranged to surround the outer periphery on an upper surface of said silicon wafer or to surround the outer periphery of either the seat or the silicon wafer, and be held compressed by the seat or by the silicon wafer and the holding member.

Pressure-adjusting device for adjusting output of integrated pressure

A method of fabricating an integrated pressure sensor, which is capable of decreasing adverse effects caused by the distortion occurring at the time when a silicon wafer and a seat are joined together. On a silicon wafer 1 are formed a thin diaphragm 2 for each of the chips, a piezo-resitance layer for each of the chips, and a signal processing circuit with an adjusting resistor for each of the chips. The silicon wafer 1 is joined onto a glass seat 6 that has pressure-adjusting passges 7 formed therein to adjust the pressure exerted on the diaphragms 2 of the silicon wafer 1. Half-dicing is effected that reaches a predetermined depth of the glass seat 6 penetrating through the silicon wafer 1 for each of the chips, and resistance of the adjusting resistor is adjusted for each of the chips while adjusting the pressure applied to the diaphragms 2 via pressure-adjusting passages 7 in the seat in a step of adjusting the pressure sensitivity by trimming the wafer and by applying a negative pressure. Finally, the silicon wafer 1 and the glass seat 6 are cut by full-dicing for each of the chips.

Method of fabricating an integrated pressure sensor

A semiconductor pressure sensor has an encased sensor unit, and a metal casing having a pressure introduction pipe and housing therein the sensor unit. The metal casing has therein synthetic resin poured by potting to fix the sensor unit securely in the metal casing. Through-type capacitors are affixed to the metal casing. The sensor unit produces an electrical signal transmitted out through the through-type capacitors and over lead wires connected to the through-type capacitors. With this arrangement, the semiconductor pressure sensor is protected against electromagnetic interference (EMI), and moisture is prevented from entering the metal casing.

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Nagoya, Japan

Michitaka Hayashi