Nitto-denko Corporation

Hitachi, Ltd.

Michirou Kawanishi

Kaoru Aizawa

Fumio Mizuno

Yutaka Moroishi

Seiichiro Shirai

Makoto Sunakawa

Masahiko Ando

Yasuyuki Tokunaga

Mitsuyoshi Shirai

Kunio Nagasaki

Noboru Moriuchi

Kiyohiro Kamei

Noburu Moriuchi

Eiji Yamanaka

Natsuko Okumura

Kyoichi Araki

Tooru Nakashima

Tatsuo Kurono

The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.

Disassemblable structure, electric equipment and non-electric equipment having disassemblable structure, and disassembling method

A tape-shaped insulating material comprises an insulating substrate and a pressure-sensitive adhesive layer provided on one side or both sides of the substrate, wherein the pressure-sensitive adhesive layer is made of an aqueous dispersion type acrylic pressure-sensitive adhesive containing a polymer emulsion that is a product of emulsion polymerization of a monomer mainly composed of Cto Calkyl(meth)acrylate ester in the presence of an emulsifying agent. The tape-shaped insulating material has an electrolytic corrosion coefficient according to JIS C-2338 of 0.98 or more, and the pressure-sensitive adhesive layer has good insulating characteristics.

Tape-shaped insulating material, insulated product and aqueous dispersion type acrylic pressure-sensitive adhesive for insulating material

A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.

Resist removing method, and curable pressure-sensitive adhesive,

A strippable pressure-sensitive adhesive and an adhesive material using the same are disclosed, adhesive comprising a highly elastic base polymer whose dynamic modulus of elasticity is in the range of from 250,000 to 10,000,000 dyne/cm.sup.2 at a temperature between ambient temperature and 150.degree. C. with a small rate of change with temperature, having incorporated therein a blowing agent, which adhesive reduces or loses its adhesiveness on expansion or blowing of blowing agent. The adhesive and adhesive material are easily re-applied, is capable of satisfactorily following the shape of an adherent during forming of the adherent, reduces its adhesiveness on heating, and is applicable to various adherents with excellent workability.

Strippable pressure-sensitive adhesive and adhesive material using the

An electronic component carrier includes an elongated substrate having a series of electronic component-setting portions spaced from one another at a predetermined interval along the length of the substrate. The substrate has push bar-insertion holes formed therethrough and disposed respectively at the electronic component-setting portions. Adhesive layers are formed respectively on surfaces of the electronic component-setting portions. The electronic components are adapted to be bonded respectively to the electronic component-setting portions through the adhesive layers. A push bar is adapted to be inserted into the push bar-insertion hole so as to be engaged with the electronic component to release the same from the adhesive layer.

Electronic component carrier

An electronic component carrier includes a carrier tape having a series of through holes formed therethrough and spaced from one another at a predetermined interval along the length of the casrrier tape. An adhesive tape having an adhesive layer is bonded to one side of the carrier tape by the adhesive layer. The adhesive layer partially covers each of the through holes. A plurality of electronic components are received respectively in the series of through holes and are bonded to that portion of the adhesive layer partially covering the through holes, thereby holding the electronic components on the carrier tape. An area of adhesive contact between the adhesive tape and the carrier tape and an area of adhesive contact between the adhesive tape and the electronic component can be isolated from each other at least in the direction of the width of the carrier tape.

Growing community of inventors

Osaka, Japan

Michirou Kawanishi