Kabushiki Kaisha Shinkawa

Michio Yonemoto

Yuji Tanaka

Eiji Kikuchi

Tsuneharu Arai

Masayuki Shimura

Eiichi Shimazaki

Mitsuo Kosuda

In die bonding in which good dies are bonded to good bonding portions of a bonding object (substrates, tapes, etc) and bad dies are bonded to bad bonding portions of the bonding object, dies on a wafer are successively detected and discriminated by a die detecting camera, dies are classified into good dies and bad dies on the basis of the results of this detection and discrimination, dies are registered on a wafer good/bad status map, and dies registered on the wafer good/bad status map are picked up by a die-transporting nozzle, transferred and bonded according to whether good dies or bad dies are requested based upon detection of bonding portions of the bonding object.

Die bonding method and apparatus

A lead frame separating and conveying device used with, for instance, a wire bonding apparatus, including a frame separating assembly that includes frame guides which support lead frames that are lined up with the flat surfaces in a vertical direction, frame suspension guides which are installed above the front ends of the frame guides in the feeding direction of the lead frames, and a frame pusher which pushes the rear end of the lead frames lined up on the frame guides so as to convey the lead frames onto the frame suspension guides. The frame suspension guides supports the lead frames in a suspended fashion and have frame separating sections which are inclined upward.

Lead frame separating and conveying apparatus

A lead frame transporting device, which uses a pusher to feed a lead frame from a loader onto feeder rails and two optical sensors that are positioned above the both sides of the lead frame. The pusher feeds the lead frame a predetermined distance so that a first detecting point of the lead frame arrives under the sensors and then further feeds the lead frame so that a second detecting point of the lead frame arrives under the sensors. The sensors detects detecting holes of the lead frame at the first and second detecting points so that top or bottom and front or back of the lead frame is detected, so that improperly oriented lead frame is prevented from further being fed to a next step.

Growing community of inventors

Musashimurayama, Japan

Michio Yonemoto