Hitachi Chemical Company, Ltd.

The Furukawa Electric Co., Ltd.

Michio Uruno

Teiichi Inada

Michio Mashino

Takayuki Matsuzaki

Keiichi Hatakeyama

Ryoji Furutani

Kouhei Horiuchi

Maiko Tanaka

Masao Suzuki

Keiji Sumiya

Masaaki Yasuda

Yasushi Shimada

Shinichi Ishiwata

Hiroyuki Kuriya

Yasumasa Morishima

Takeo Tomiyama

Junichi Imaizumi

Masaya Nishiyama

Tetsurou Iwakura

Kenji Kita

Yuuko Tanaka

Hiroaki Takahashi

Seiji Sunohara

Tetsuro Iwakura

Tomoyuki Nakamura

Yasushi Numaguchi

Yuuji Hasegawa

Mitsuyoshi Shimamura

An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 &#x3bc;m and 200 &#x3bc;m, the average notch depth is between 5 &#x3bc;m and 45 &#x3bc;m and the standard deviation for the notch depth is no greater than 15 &#x3bc;m. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer.

Adhesive film

The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100&#xb0; C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

An adhesive sheet comprising a release substrate, a substrate film, and a first tacky-adhesive layerplaced between the release substrateand the substrate film, wherein an annular incision D is formed on the release substratefrom the surface of the first tacky-adhesive layerside, the first tacky-adhesive layeris laminated so as to cover the whole inner surface of the incision D in the release substrate, and the incision D has a depth d of less than the thickness of the release substrateand 25 &#x3bc;m or less.

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of &#x2212;50&#xb0; C. to 50&#xb0; C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 &#x3bc;m.

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

Dicing/die bonding sheet

There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device

Growing community of inventors

Ichihara, Japan

Michio Uruno