Hitachi, Ltd.

Michio Takahashi

Tooru Mita

Shigeo Nakamura

Mikio Tokuyama

Hiroyuki Tanaka

Aizo Kaneda

Shinichi Arai

Yasuo Nakagawa

Koichi Sugimoto

Toshimitsu Hamada

Seiji Hata

Hisafumi Iwata

Masayasu Fujisawa

Tsutomu Mimata

Issei Takemoto

Kazushige Hashimoto

Toshihiko Sakai

Yoshio Matsumoto

Yasuyuki Nakajima

Shiyuki Sakaue

Yukimori Umakoshi

Noboru Sugimoto

Michinaga Kohno

Keii Ueno

Makoto Ariga

Yoshikazu Suzumura

Kooji Serizawa

Tatsuhiro Suzuki

Katsuya Fukasawa

Kouji Serizawa

Keizo Matsukawa

Masaaki Nakagima

The magnetic head assembly including a magnetic head having a terminal composed of a conductive film and a supporting spring. The supporting spring has interconnecting patterns (lines) on the top thereof and a projective electrode. The terminal of the magnetic head is electrically connected to the projective electrode of the supporting spring by a solderless, direct contact connection. The magnetic head is fixed to the supporting spring by using a non-electrical bonding agent. This structure makes it possible to stabilize the position of the magnetic head assembly and the relative speed variation between the magnetic head element and the magnetic disk, thereby enhancing the reliability of the magnetic disk apparatus.

Method of electrically connecting a magnetic head, a magnetic head body and a magnetic disc apparatus

The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.

Method of aligning and bonding tab inner leads

As a die bonding apparatus for establishing electrical connection between electrodes on one side of a semiconductor chip and associated electrodes on a package comprises a pair of pinching and pressing mechanisms having a pair of pinching and pressing surfaces adapted to be moved closer relative to each other and so as to pinch and press semiconductor chip and package and at least one remote center mechanism provided in at least one of the pair of pinching and pressing mechanisms, in such a manner that a remote center thereof is positioned in the pinching and pressing surface of above-mentioned one pinching and pressing mechanism, for adjusting orientations of the pair of pinching and pressing surfaces to make the orientations thereof correspond to those of both surfaces of the semiconductor chip and the package at the time of the pressing and pinching operation all of the electrodes on one side of the semiconductor chip are thereby uniformly pressed against the corresponding electrodes on the package without any laterally shifting movement thereof even if the chip is inclined relative to the package because the sizes of bumps of the electrodes on the chip are not constant.

Die bonding apparatus

A segmentation apparatus utilized in an image processing system for recognizing a pattern in an image inputted thereto includes a separate circuit for outputting logical values of m by n pixels separated from the inputted image, an encode circuit for storing in advance therein codes to be determined according to the content of an inputted pattern and for outputting a code indicating that which set of pixels is identical to the objective pixel by using as an input pattern the logical value outputted from the separate circuit, and a select circuit for selecting a label of the objective label, from the label data of neighborhood pixels already determined and the new label data assigned, in accordance with the output from the encode circuit.

Image processing segmentation apparatus

An articulated industrial robot comprising a supporting post mounted on a base; a forearm provided at its end with a wrist having at least one degree of freedom; a pair of upper arms pivotally connected at their one ends to the supporting post and at their other ends to the forearm, the upper arms being disposed in parallel with each other at both sides of the supporting post and the forearm; an upper arm rotary driving source mounted in the supporting post; an upper arm connecting mechanism for connecting the output of the upper arm rotary driving source to the upper arm through a reduction gear; a forearm rotary driving source mounted on one of the upper arms; a forearm connecting mechanism for connecting the output of the forearm rotary driving source to the forearm through a reduction gear; a wrist posture controlling rotary driving source provided on the other upper arm or on the supporting post; and a wrist posture controlling connecting mechanism for connecting the output of the wrist posture controlling rotary driving source to the wrist through the other upper arm and through the forearm through a reduction gear.

Articulated industrial robot

Growing community of inventors

Yokohama, Japan

Michio Takahashi