Akebono Brake Industry Co., Ltd.

Senju Metal Industry Co., Ltd.

Mitsuba Corporation

Michio Suzuki

Hiroyuki Kato

Shinichi Yamadera

Hideki Nakamura

Koji Watanabe

Isamu Sato

Yuta Yamaguchi

Hiroyasu Ishikawa

Naoto Kameda

Kota Kikuchi

Hironori Akada

Takeshi Kuroki

Masataka Kobayashi

Ryosuke Kimura

A motor gear unit for a disc brake apparatus includes an electric motor, a speed reduction mechanism configured to transmit rotation of the electric motor to a plurality of rotary-to-linear motion conversion mechanisms arranged in a plurality of cylinders provided in a caliper, and a housing accommodating the electric motor and the speed reduction mechanism. The speed reduction mechanism includes a plurality of final gears connected directly or via another member to the plurality of rotary-to-linear motion conversion mechanisms and a power distribution mechanism that includes one support shaft and that is configured to distribute and transmit input power to the plurality of final gears. The power distribution mechanism is supported by the housing by supporting and fixing end portions of the support shaft on axially both sides to the housing.

Motor gear unit for disc brake apparatus and disc brake apparatus

A motor gear unit for a disc brake apparatus is provided. A speed reduction mechanism is connected to a first connection portion of a motor shaft of an electric motor. A non-excited operation type brake is connected to a second connection portion of the motor shaft. In a state where the disc brake apparatus is attached to a vehicle body, the motor shaft is disposed so as to be orientated in an upper-lower direction, and the non-excited operation type brake is disposed above the electric motor.

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few &#x3bc;m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG., this apparatus comprises a solder bathof accommodating the molten solder; a second conveying sectionfor drawing up a strip memberfrom the solder bath; and a blower sectionfor blowing hot gas on the strip memberimmediately after being drawn up from the solder bath by a second conveying section; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder. According to this configuration, the excess molten soldercan be trimmed from the strip membercorresponding to composition of the molten solder. Thus, the film thickness of the molten soldercoated on the strip membercan be controlled evenly and in increments of a few &#x3bc;m.

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

Growing community of inventors

Tokyo, Japan

Michio Suzuki