Taiyo Yuden Co., Ltd.

Michio Oshima

Tomoaki Nakamura

Mikio Tahara

Hiroaki Uenishi

Takehiko Kamobe

Yoshinori Shibata

Jyouji Ariga

Daisuke Iwai

Atsuhiro Yanagisawa

Hiroyuki Moteki

Keigo Nakamura

Shunya Fukuda

A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers so as to face each other, each of the plurality of internal electrode layers being stacked via each of the plurality of dielectric layers, an external electrode that is provided on an end face of the multilayer chip, contacts each end of at least a part of the plurality of internal electrode layers, and includes a co-material, the end face being an end of the multilayer chip in a direction in which the plurality of internal electrode layers extend, and a projection portion that is provided between the external electrode and the multilayer chip and has a projection shape toward the external electrode from the multilayer chip. A main component of the projection portion is ceramic including at least Ba, Ca and Ti.

Ceramic electronic device and manufacturing method of the same

A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.

Ceramic electronic device and manufacturing method of ceramic electronic device

A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

A multilayer ceramic capacitor includes: a ceramic multilayer structure having a structure in which each of ceramic dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the ceramic multilayer structure, a main phase of the plurality of ceramic dielectric layers having a perovskite structure that includes Ca and Zr and is expressed by a general formula ABO; and a pair of external electrodes that are formed on the two edge faces, wherein 300&#xd7;TE/TA&#x2212;12&#x2264;30 is satisfied when a volume TA is a length C&#xd7;a width C&#xd7;a thickness Cof the ceramic multilayer structure and a volume TE is a length E&#xd7;a width E&#xd7;a thickness E&#xd7;a stacked number of the plurality of internal electrode layers in a capacity region.

Multilayer ceramic capacitor, circuit substrate and manufacturing method of the same

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Takasaki, Japan

Michio Oshima