Fujitsu Corporation

Nippon Telegraph and Telephone Corporation

Nissan Motor Company Limited

Sunallomer Ltd.

Michio Ono

Tsuyoshi Aoki

Rikio Sugiura

Tadayuki Imai

Hiroki Yamazaki

Akihiro Kubota

Haruki Kozawaguchi

Shougo Yagi

Kazuto Tsuji

Hiroki Imada

Hiroyuki Kitasako

Kazuhiro Maeda

Osamu Inoue

Osamu Kikuchi

An inexpensive multi-layered holographic read-only memory having a large capacity is provided. In the memory in which single-mode slab waveguides are multi-layered, a periodic scattering center whose period approximately agrees with the period of the guided mode is provided in at least one of a core layer and a clad layer in each waveguide so that a guided wave in the waveguide is diffracted by the periodic scattering center to the outside of the waveguide and a holographic image is generated.

Multi-layered holographic read-only memory and data retrieval method

The present invention relates to interior parts of a car comprising a new propylene resin composition. The present resin composition has good molding abilities and a good balance of physical properties as well as a good appearance, lower gloss and scratch resistance. Specifically, the present invention relates to a molded article for interior parts of a car comprising a polypropylene resin composition comprising the following components; a crystalline homopolypropylene having MFR of 500 to 3,000 g/10 min.; a polypropylene consisting of a crystalline homopolypropylene and an ethylene-propylene copolymer rubber having 45 to 80% by mass of a ethylene content; a polypropylene consisting of a crystalline homopolypropylene and an ethylene-propylene copolymer rubber having 25% by mass or more to below 45% by mass of a ethylene content; and an ethylene-&#x3b1;-olefin copolymer rubber.

Molded article for interior parts of a car

In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

Semiconductor device and a method for fabricating the same

A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.

Resin-molded semiconductor

Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.

High packing density lead frame and integrated circuit

PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.

Package for integrated circuit

A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.

Growing community of inventors

Tokyo, Japan

Michio Ono