Renesas Technology Corp.

Tosoh Corporation

Hitachi, Ltd.

Michio Okamoto

Takeshi Saito

Yuichi Morinaga

Yuji Ikeda

Koyata Takahashi

Osamu Matsunaga

Tsutomu Mimata

Susumu Okikawa

Takeshi Kawana

Masanori Abe

Toosaku Kojima

Satoshi Urayama

Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.

Inlet for an electronic tag

A component for a vacuum apparatus for use in a plasma processing apparatus or a film forming apparatus for a semiconductor or the like, in which a surface is covered with a ceramic and/or metallic thermal spray film and projection-shaped particles of a width of 10-300 &#x3bc;m, a height of 4-600 &#x3bc;m and an average height/width ratio of 0.4 or higher are present within a range of 20-20,000 particle/mmon the surface of the thermal spray film. The thermal spray film has a porosity of 10-40%, shows a high adhering property to a film-shaped substance, is free from a product contamination by particles generated by a peeling of the film-shaped substance and can be continuously used over a prolonged period.

Component for vacuum apparatus, production method thereof and apparatus using the same

In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.

Method for manufacturing electronic tag

In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc., there are problems such as peeling off of the parts themselves during the use, peeling off of film-like substances adhered to the part surfaces, contamination of the products and short life time of the parts caused by corrosion of the part surfaces by plasma, and reduction in the productivity by frequent exchange of the parts. In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc., with respect to parts, the surface of which is constituted of a ceramic thermal sprayed coating, ones having the ceramic thermal sprayed coating having a surface roughness Ra of from 5 to 20 &#x3bc;m are high in adherence of a film-like adherence, ones having the ceramic thermal sprayed coating having a surface roughness Ra of from 1 to 5 &#x3bc;m are high in plasma resistance, and ones in which grooves having a large anchor effect to the thermal sprayed coating is formed on a substrate on which the ceramic thermal sprayed coating is formed are free from peeling off of the ceramic thermal sprayed coating from the substrate and are high in durability.

Quartz glass parts, ceramic parts and process of producing those

Method of manufacturing electronic tag

A method of bonding an insulated and coated wire which has an insulated coating on the outside of an electrically conductive wire is disclosed which consists in connecting one end of said insulated and coated wire to the anode side of an arc power source and connecting a discharge torch to the cathode side of said arc power source with an arc discharge performed between the tip of said insulated and coated wire and the discharge torch to form a ball at said end, and said ball being positioned with respect to the bonding pad of an electrically conductive electrode and bonding being performed with a specified pressure applied to said ball.

Method and apparatus of bonding insulated and coated wire

Growing community of inventors

Machida, Japan

Michio Okamoto