Catalysts & Chemicals Industries Co., Ltd.

Jgc Catalysts & Chemicals Ltd.

Other

Asahi Glass Company, Limited

Fujitsu Corporation

Nippon Telegraph and Telephone Corporation

Eco Research Institute Ltd.

Michio Komatsu

Akira Nakashima

Hiroyasu Nishida

Toshiharu Hirai

Tsuguo Koyanagi

Miki Egami

Kazuhiro Nakayama

Goro Sato

Yoneji Abe

Ryo Muraguchi

Yuji Tawarazako

Mitsuaki Kumazawa

Kazuaki Inoue

Masayuki Matsuda

Naoyuki Enomoto

Katsuhiro Shirono

Yoshinori Wakamiya

Mitsuru Nakai

Yukihiro Iwasaki

Yoshichika Tanaka

Keiichi Mihara

Hirokazu Tanaka

Yoichi Ishihara

Atsushi Tonai

Shinya Usuda

Ei Yano

Katsumi Suzuki

Yoshihiro Nakata

Hiroki Arao

Shota Kawakami

Hiroo Yoshidome

Satoshi Watanabe

Katsuyuki Machida

Takeo Ito

Hidemi Matsuda

Hakaru Kyuragi

Takamichi Matsushita

Kazuo Imai

Kiyoshi Nagano

Yasutaka Miyoshi

Atsushi Tanaka

Kazutaka Egami

Masanobu Taniguchi

Manabu Watanabe

Sachio Murai

Teruo Migita

Yuki Miwa

Tatsuya Mukai

Tetsuya Tanaka

Noboru Senju

Shogo Hayashi

Kazuhiko Yui

Yoshimi Otani

Hiroo Yoshitome

Nobuaki Yoshida

Yutaka Mitsuo

Kenji Ohno

Kuniharu Teramoto

Kensuke Nagata

Kei Mihara

Shingo Kashiwada

Noboru Senjyuu

Kei-ichi Mihara

Takahumi Ishikubo

Mitsuru Ohkuma

Kiyohide Mimura

Toshikatsu Matsuoka

Ei c/o Fujitsu Limited Yano

Yoshihiro Fujitsu Limited Nakata

A silica particle dispersion liquid includes a silica particle that satisfies (i) to (iii) below: (i) an average particle diameter d is 5 to 300 nm; (ii) an occlusion amount of a basic substance per 1 g of the particle is 2 mg or more; and (iii) a Sears number Y exceeds 12.0.

Silica particle dispersion liquid and production method thereof

A silica-based particle dispersion including a silica-based particle group and a high polishing rate and high surface precision is achieved to a silica-based substrate or a NiP-plated substrate to be polished or the like. A silica-based particle dispersion containing a group including irregularly-shaped and non-irregularly-shaped silica-based particles, wherein the irregularly-shaped silica-based particles each have a plurality of small holes thereinside and a covering silica layer which covers the core, and the silica-based particle group satisfies [1]-[3]. [1] Having an average particle size (D) of 100-600 nm, and a particle size (D) of 30-300 nm in terms of specific surface area. [2] An irregular-shape degree D (D=D/D) represented by the average particle size (D) and a projected area-equivalent particle size (D) being in the range of 1.1-5.0. [3] When waveform separation is performed on a volume-reference particle size distribution, a multi-peak distribution in which three or more peaks are detected.

Silica-based particle dispersion and production method therefor

Provided is a production method of a silica particle dispersion liquid which includes, preparing a linked silica particle by adding a liquid A containing alkoxysilane and a liquid B containing an alkali catalyst to a liquid containing water, an organic solvent, and an alkali catalyst in a container. The preparing a linked silica particle includes initially adding an alkali catalyst, the initially adding an alkali catalyst includes decreasing a molar ratio of an alkali catalyst to silica in the liquid in the container to 0.15 to 0.60 by adding the liquid A containing alkoxysilane to the liquid in the container, and increasing the molar ratio by 0.2 or more by adding the liquid B to the liquid having the decreased molar ratio in the container.

An object of the present invention is to provide a nanobubble-containing inorganic oxide fine particle dispersion having excellent concentration stability in a process used as an abrasive. The object is achieved by the nanobubble-containing inorganic oxide fine particle dispersion including: inorganic oxide fine particles having an average particle size of 1 to 500 nm and containing fine particles containing Ce; and nanobubbles having an average cell size of 50 to 500 nm and being at least one non-oxidizing gas selected from a group consisting of Nand H.

Nanobubble-containing inorganic oxide fine particle and abrasive containing same

A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.

Dispersion liquid of silica particles, polishing composition, and method for producing dispersion liquid of silica particles

Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, disclosed is a ceria-based composite particle dispersion that contains a ceria-based composite particle that has an average particle size of 50 to 350 nm, to solve the aforementioned problem, featured by that the ceria-based composite particle has a mother particle, a cerium-containing silica layer, a child particle, and an easily soluble silica-containing layer; the mother particle contains amorphous silica as a major ingredient; the child particle contains crystalline ceria as a major ingredient; ratio of the mass of the easily soluble silica-containing layer relative to the mass of the ceria-based composite particle falls in a specific range; mass ratio of silica and ceria in the ceria-based composite particle falls in a specific range; the ceria-based composite particle, when analyzed by X-ray diffractometry, shows only a crystal phase of ceria; and the ceria-based composite particle has an average crystallite size of the crystalline ceria, when analyzed by X-ray diffractometry, of 10 to 25 nm.

Ceria-based composite fine particle dispersion, production method therefor, and polishing abrasive grain dispersion including ceria-based composite fine particle dispersion

A polishing composition comprising an abrasive grain; a modified microfibril cellulose in which at least a part of the cellulose units has a hydroxyl group at the C6 position oxidized to a carboxyl group; and a dispersion medium, wherein each content of Na and K is 100 ppm or less relative to the solids weight.

Polishing composition

A ceria composite particle dispersion has ceria composite particles having an average particle size of 50 to 350 nm and having the features described below. Each ceria composite particle has a mother particle, a cerium-containing silica layer on the surface thereof, and child particles dispersed inside the cerium-containing silica layer, the mother particles being amorphous silica-based and the child particles being crystalline ceria-based. The child particles have a coefficient of variation (CV value) in a particle size distribution of 14 to 40%. The ceria composite particles have a mass ratio of silica to ceria of 100:11-316. Only the crystal phase of ceria is detected when the ceria composite particles are subjected to X-ray diffraction. The average crystallite size of the crystalline ceria measured by subjecting the ceria composite particles to X-ray diffraction is 10 to 25 nm.

Ceria composite particle dispersion, method for producing same, and polishing abrasive grain dispersion comprising ceria composite particle dispersion

Disclosed is a silica-based composite fine particle dispersion including a silica-based composite fine particle which comprises a mother particle containing amorphous silica as a main component with a child particle containing crystalline ceria as a main component on a surface thereof. Features of the silica-based composite fine particle include a silica to ceria mass ratio of 100:11 to 316, and when subjected to X-ray diffraction, only the crystalline phase of ceria is detected, and when subjected to X-ray diffraction for measurement, the crystalline ceria has a crystallite diameter of 10 to 25 nm.

Silica-based composite fine particle dispersion and method for manufacturing same

Provided is a dispersion containing high-purity silica particles and a method for producing the same. A first solution containing a silane alkoxide and a second solution containing fine bubbles having an average bubble diameter of 40 nm to 10 &#x3bc;m are mixed. Thus, the silane alkoxide is hydrolyzed without using an alkaline catalyst in a liquid phase containing the fine bubbles, so that uniform silica particles having an average particle size of 3 to 10 nm are produced. Further, hydrolysis is carried out by adding a hydrolyzable metal compound to the dispersion containing the silica particles in the presence of the fine bubbles and the alkaline catalyst. Thus, the silica particles are grown, so that a uniform silica-based particle dispersion containing particles having an average particle size of more than 10 nm and 300 nm or less is produced.

Silica particle dispersion and method for producing the same

A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them.

Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion

Silica particles calcined in a calcination step are supplied in a swirling flow generated by a gas introduced in a disintegration container and disintegrated therein, whereby the silica particles can be easily disintegrated and there can be obtained disintegrated silica particles having both low hygroscopicity and high dispersibility in resin. In addition, the introduction of dehumidified air (gas) during the disintegration reduces hygroscopicity and greatly improves dispersibility in resin. Furthermore, performing heating treatment (calcination) again after the disintegration causes the surface modification of the disintegrated silica particles, greatly improving hygroscopicity and dispersibility in resin. The resin composition obtained in this manner including silica particles provides good injectability and filterability when used for an underfill material for semiconductors and an in-plane spacer or sealing spacer of liquid crystal displays.

Method for producing disintegrated silica particles

A porous silica particle optimized as the scrubbing agent is used for a cleansing cosmetic. The porous silica particle has an average circularity of 0.1 to 0.5, a pore volume of 1.0 to 2.0 ml/g, a mode diameter of 50 to 600 &#x3bc;m, and a ratio of the maximum particle diameter to the mode diameter of 3.0 or less. The porous silica particle moreover has a median size of 0.5 to 25 &#x3bc;m and the maximum particle diameter of 1 to 100 &#x3bc;m, after rubbing with a load of 1.0 to 1.4 KPa for 30 seconds. With the cleansing cosmetic containing this particle, the skin is rubbed by the frictional force generated by the friction with the skin at the rubbing. Therefore, the mild peeling effect for the stratum corneum is obtained and the damage of the skin and the micro damage on the stratum corneum can be prevented.

Porous silica particle and cleansing cosmetic

A method for producing a high purity silica sol is provided. This method has enabled use of water glass for the starting material, and the resulting silica sol has a reduced metal impurity Cu and Ni content compared to conventional methods. The method comprises (1) ultrafiltration of an aqueous solution of an alkali silicate; (2) ion exchange process for removal of at least a part of cationic components in the purified aqueous solution of an alkali silicate; (3) another ion exchange process using a chelating ion exchange resin to obtain high purity silicate solution; and (4) adjustment of a part of the high purity silicate solution (seed solution) to alkaline pH and mixing of this solution with another part of the solution (feed solution) to produce a high purity silica sol having a Cu concentration and a Ni concentration (in relation to the dry silica) of up to 50 ppb.

High purity silica sol and its production method

Core-shell type composite oxide fine particles are described in which the core particles are oxide fine particles or composite oxide fine particles that do not contain silicon and/or aluminum as main components, and the surface of the core particles is covered with a shell including a composite oxide that contains silicon and aluminum as main components, the shell containing silicon and aluminum in a weight ratio in terms of oxides, SiO/AlO, in the range of 2.0 to 30.0. A dispersion liquid of the core-shell type composite oxide fine particles exhibits very high stability.

Dispersion liquid of core-shell type composite oxide fine particles, process for producing the dispersion liquid, and coating composition containing the fine particles

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Kitakyushu, Japan

Michio Komatsu