Tokyo Electron Limited

Michio Kinoshita

Tsunenaga Nakashima

Kazuhiko Ito

Kousuke Nakamichi

Naruaki Iida

Yuichi Douki

Jun Ookura

Kazutoshi Ishimaru

A liquid processing method forms a coating film by supplying and pouring a coating solution from a coating solution nozzle onto a surface of a substrate held substantially horizontally by a substrate holder. In the liquid processing method, a process for photographing a leading end portion of a coating solution nozzle is provided. When performing a process for anti-drying of the coating solution for a long period of time in advance, a position of the coating solution and a position of an anti-drying liquid are set by using a soft scale displayed on a screen where the photographed image is displayed. Therefore, a dispense control is performed based on a set value without depending on the naked eyes and a control for suppressing the drying of the coating solution in the leading end portion of the coating solution nozzle is performed.

Liquid processing method

Provided is a liquid processing apparatus (method) that forms a coating film by supplying and pouring a coating solution from a coating solution nozzle onto a surface of a substrate held substantially horizontally by a substrate holder. In the liquid processing apparatus (method), a unit for photographing a leading end portion of a coating solution nozzleis provided. When performing a process for anti-drying of the coating solution for a long period of time in advance, a position of the coating solution and a position of an anti-drying liquid are set by using a soft scaledisplayed on a screen where the photographed image is displayed. Therefore, a dispense control is performed based on a set value without depending on the naked eyes and a control for suppressing the drying of the coating solution in the leading end portion of the coating solution nozzle is performed.

Liquid processing apparatus and liquid processing method

A wet processing system detects a globule of a process solution in a drippy or dripping state from the tip of any one of process solution pouring nozzles being moved to a pouring position for pouring the process solution onto a substrate by obtaining image data on the process solution pouring nozzle, and takes proper measures to prevent the process solution from dripping. A wet processing systempours a process solution, such as a resist solution, through one of process solution pouring nozzlesonto a surface of a substrate, such as a wafer W, held substantially horizontally by a substrate holding devicesurrounded by a cupto process the surface by a wet process. A nozzle carrying mechanismcarries the process solution pouring nozzlesbetween a home position on a nozzle bathand a pouring position above the substrate held by the substrate holding device. An optical image of the tips of the process solution pouring nozzlesis obtained by an image pickup means, such as a camera. Predetermined measures are taken according to the level of a drippy or dripping state of a globule of the process solution.

Wet processing system, wet processing method and storage medium

A substrate processing apparatus can align a substrate with a high precision and a high speed by monitoring a mark formed on a surface of the substrate; operating an amount of misalignment between the center of the substrate and a rotation center of a substrate support member; determining a presence of the misalignment and adjusting the substrate such that the center of the substrate coincides with the rotation center of the substrate support member.

Substrate processing apparatus and method for adjusting a substrate transfer position

The present invention has a first optical detection mark having a predetermined positional coordinate in a lateral direction with respect to a carrier opening of a processing unit through which a carrier apparatus enters and exits, a second optical detection mark having a predetermined positional coordinate in a vertical direction with respect to the carrier opening, and an optical sensor provided on the substrate carrier apparatus for detecting the first or second optical detection mark. The substrate carrier apparatus is rotated by a predetermined angle from a position of the substrate carrier apparatus where the optical sensor detects the first optical detection mark, and the substrate carrier apparatus is moved in the vertical direction by a predetermined amount of movement from a position of the substrate carrier apparatus where the optical sensor detects the second optical detection mark. After the substrate carrier apparatus faces the carrier opening of the processing unit, the substrate carrier apparatus is allowed to enter the processing unit to acquire in advance a precise transfer position when transferring a substrate to a predetermined position on a mounting table in the processing unit.

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Kumamoto, Japan

Michio Kinoshita