Lintec Corporation

Michio Kanai

Yosuke Sato

Hideki Numazawa

Hayato Nakanishi

A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 &#x3bc;m. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G' at 23&#xb0; C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23&#xb0; C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 &#x3bc;m and a diameter of 15 &#x3bc;m at a pitch of 40 &#x3bc;m having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 &#x3bc;m or less of the electrode.

Dicing sheet and a production method of a semiconductor chip

Disclosed is an ultraviolet-curable pressure sensitive adhesive composition comprising an ultraviolet-curable pressure sensitive adhesive component and a phosphorus type photopolymerization initiator. Also disclosed is an ultraviolet-curable pressure sensitive adhesive sheet obtained by coating a substrate with the ultraviolet-curable pressure sensitive adhesive composition. The ultraviolet-curable pressure sensitive adhesive composition is capable of retaining ultraviolet curing properties even if the ultraviolet-curable pressure sensitive adhesive sheet is brought into contact with wash water for a long period of time.

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Tokyo, Japan

Michio Kanai