Shinko Electric Industries Co., Ltd.

Other

Michio Horiuchi

Yasue Tokutake

Shigeaki Suganuma

Yuichi Matsuda

Misa Watanabe

Ryo Fukasawa

Takashi Kurihara

Yukiharu Takeuchi

Yoichi Harayama

Shigetsugu Muramatsu

Fumimasa Katagiri

Masaya Tsuno

Tomoo Yamasaki

Shigeru Mizuno

Jun Yoshiike

Shuji Yamazaki

Chiaki Takubo

Mitsuhiro Aizawa

Yuta Sakaguchi

Yukio Shimizu

Eiji Yoda

Kihou Mizushima

Naoyuki Koizumi

Tsuyoshi Kobayashi

Mohan Kirloskar

Tomotake Minemura

Takuya Kazama

Masao Nakazawa

Kazunari Sekigawa

Yuichiro Shimizu

Sumihiro Ichikawa

Masakuni Tokita

Kazunari Imai

Masakuni Miyazawa

Yuka Tamadate

Ryuichi Matsuki

Kazunori Sato

Shinji Nakazawa

Toshiaki Suyama

Tomio Nagaoka

Masao Aoki

Hidemi Akada

Tsuyoshi Machii

Shoichi Iwai

Koishiro Hayashi

Ryosuke Hori

Yuko Karasawa

Kazue Ban

An electrostatic chuck includes a base body, and an electrostatic electrode embedded in the base body. The base body is a ceramic. The electrostatic electrode has TiO, which is an oxide of titanium, as a main component, and an atomic ratio y/x is less than 1.7.

Electrostatic chuck, substrate fixing device and paste

A substrate detaching apparatus for detaching a substrate attracted to and held onto an attraction surface of an electrostatic chuck includes a moving unit configured to push and move the substrate in a direction parallel to the attraction surface.

Substrate detaching apparatus

A composite oxide contains oxides of aluminum, strontium, cerium, lanthanum, and manganese. A light emitting aspect of the composite oxide when the composite oxide is irradiated with a first electromagnetic wave having a wavelength not longer than 300 nm is different from a light emitting aspect of the composite oxide when the composite oxide is irradiated with a second electromagnetic wave having a wavelength longer than 300 nm.

Ultraviolet detection device comprising a ceramic substrate and composite oxides

A light emitting device includes a light-transmissive ceramic substrate, a light emitting element mounted on the ceramic substrate, a wiring arranged inside the ceramic substrate and electrically connected to the light emitting element, a base material faced to the ceramic substrate, and a seal member hermetically sealing a gap between the ceramic substrate and the base material. The light emitting element is arranged in a space surrounded by the ceramic substrate, the base material, and the seal member. The wiring includes a wiring layer extending in a planar direction of the ceramic substrate.

Light emitting device

A composite green sheet includes a green sheet, and a bulk metal film provided on the green sheet. Examples of the metal forming the metal film may include aluminum, aluminum alloys, copper, copper alloy, or the like.

Composite green sheet and ceramic member

A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.

Light emitting device with wiring enclosed by ceramic substrate

An ultraviolet detection material includes a composite oxide including aluminum, strontium, cerium, lanthanum and manganese, and a glass having a softening point of 900&#xb0; C. or lower. The ultraviolet detection material is not excited by an electromagnetic wave having a wavelength longer than 310 nm and is excited by an electromagnetic wave having a wavelength equal to or shorter than 310 nm, thereby emitting light having a peak of an emission wavelength in 480 nm or longer and 700 nm or shorter.

Ultraviolet detection material and ultraviolet detection device

A lanthanoid element is included in a part of a material of a member for an electrostatic chuck configured to suck a target object by using an electrostatic force. When electromagnetic waves in a wavelength region shorter than 400 nm are irradiated, the member emits light in a wavelength region different from the wavelength region.

Member for electrostatic chuck and electrostatic chuck

An electrostatic chuck includes at least one conductor layer; an electrostatic electrode; and a base body in which the electrostatic electrode is embedded, the base body having a first dielectric layer on which the electrostatic electrode is mounted, the base body having a second dielectric layer stacked on the first dielectric layer with covering the electrostatic electrode. The conductor layer is formed on a surface of the first dielectric layer opposite to a surface on which the electrostatic electrode is mounted. The second dielectric layer has a first surface facing the first dielectric layer and a second surface opposite to the first surface, and the second surface is a placement surface on which a suction target is placed. A relative permittivity of the first dielectric layer is lower than a relative permittivity of the second dielectric layer.

Electrostatic chuck and substrate fixing device

A ceramic member includes: a ceramic sintered body; and a conductive member of aluminum or an aluminum alloy provided in the sintered body.

Ceramic member

A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.

Sintered body and electrostatic chuck

A wiring substrate includes a buried substrate disposed within a through-hole penetrating through a resin substrate of a core layer and including a plate-like body and a plurality of linear conductors penetrating the plate-like body, a first insulating layer covering a first surface of the resin substrate, a first wiring layer including a first pad pattern formed on a first surface of the buried substrate and a first wiring pattern formed on a first surface of the first insulating layer, and a third wiring pattern formed on the first surface of the resin substrate and covered by the first insulating layer. In the plurality of linear conductors, a gap between the adjacent linear conductors is smaller than a diameter of each of the linear conductors. The third wiring pattern is formed so as to have a thickness thicker than a thickness of the first wiring pattern.

Wiring substrate with buried substrate having linear conductors

A semiconductor device includes a first electronic component mounted to an upper face of a plated interconnect layer, a second electronic component mounted to a lower face of the plated interconnect layer, a first resin part covering the first electronic component on an upper side of the plated interconnect layer, and a second resin part covering the second electronic component on a lower side of the plated interconnect layer, wherein the first and second electronic components at least partially face each other across the plated interconnect layer, wherein the plated interconnect layer includes a sloping portion disposed on a sloping boundary between the first and second resin parts, and wherein an end part of the sloping portion is bent to have a face thereof exposed from the second resin part, and a lower surface of the second resin part is flush with the face of the end part.

Semiconductor device and method of making the same

A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.

Probe card having a wiring substrate

A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.

Probe card

Growing community of inventors

Nagano, Japan

Michio Horiuchi