Mitsubishi Denki Kabushiki Kaisha

Michio Futakuchi

Hiroyuki Nakajima

Takashi Takahama

Seiji Oka

Takumi Kikuchi

Hidetoshi Kitakoga

Mitsuhiro Nonogaki

A semiconductor integrated circuit device having a ball grid array package includes a core material including a semiconductor chip and a sealing resin layer surrounding the chip and surface materials including a carrier base and a reinforcement in a sandwich structure for high stiffness against being and high reliability of connection to a printed wiring board even during heat cycling.

Semiconductor integrated circuit device

A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Composition of phenolic resin-modified epoxy resin and straight chain

Epoxy resin composition, epoxy resin cured material, and laminated sheet

A method of producing a fiber reinforced plastic product which includes the steps of winding a strand or rovings on a mandrel prepared by a filament winding method in three directions of substantially +60 degrees, -60 degrees and 0 degrees to the axis of the mandrel in desired turns to form braid fabric reinforced in three directions; impregnating a resin before or after the winding step; cutting out the resin impregnated braid fabric from the mandrel to obtain a prepreg reinforced in three directions; and fabricating the prepreg in a desired configuration for a product by heating and a fiber reinforced plastic product made by the method.

Process for preparing fiber reinforced plastics

Growing community of inventors

Sagamihara, Japan

Michio Futakuchi