Shin-etsu Chemical Co., Ltd.

Michio Aizawa

Tadashi Amano

Shigehiro Hoshida

Hitoshi Arai

Akira Hayashida

Masahiro Usuki

Ken Yahata

Yasuyoshi Komoto

Kazunori Kondo

Makoto Fujiwara

A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 &#x3bc;m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 &#x3bc;m. The polyimide adhesive layer has a Tg&#x3e;400&#xb0; C.

Preparation of flexible copper foil/polyimide laminate

An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30&#xb0; C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing and handling as well as good adhesion, and is suited for use in the manufacture of FPC.

Acrylic adhesive sheet

A polyimide precursor resin solution composition sheet having a solvent content of 1&#x2013;50% by weight and a thickness of 1&#x2013;10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.

Polyimide precursor resin solution composition sheet

Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:

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Ibaraki-ken, Japan

Michio Aizawa