Fujitsu Corporation

Michinori Matsubayashi

Yasuhiro Teshima

Masayoshi Suzuki

Katsuo Okuyama

Mamoru Niishiro

Masao Ishiwata

Shigeru Kubo

Toshinari Matsui

Kazuhide Toyoda

Masao Shukuya

Kouji Sudou

Eiko Takei

Hideo Ohata

Hidetoshi Uchibori

Hidekazu Morihiro

The present invention is to provide an equipment production management system, in which the electronic equipment is designed corresponding to an order from customers, which enables unified preparation from derivation of equipment corresponding to the customer conditions concerning equipment installation design, and construction associated drawing design. The system includes a terminal unit and a central control system, in which is provided a customer base order information file, design data file, a design know-how information file established by making a know-how library on the equipment installation design as input files. The central processing system includes an installation designing section corresponding to installation design for respective stages from overall layout to installation of the elementary parts. The installation design section prepares an installation design drawing adapting various conditions input using the design data file and design know-how information file in response to the input of customer order information.

Management system for manufacture

For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

Heating furnace in combination with electronic circuit modules

Growing community of inventors

Utsunomiya, Japan

Michinori Matsubayashi